Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA
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Experimental 83<br />
2.5 Datalogger<br />
This is a device for in situ real-time monitoring <strong>of</strong> the sample temperature <strong>and</strong><br />
electromagnetic field intensity during the microwave cure process.<br />
It consists <strong>of</strong> an hermetic aluminum box, containing electronic circuits, conveniently<br />
screened against electromagnetic interferences, with a radio absorbing<br />
trimming.<br />
The datalogger operation is based on a PIC18 Microchip, on which the s<strong>of</strong>tware<br />
for managing the acquisition, storage <strong>and</strong> transfer <strong>of</strong> the information to the PC is<br />
installed. In the Figures 2.20 <strong>and</strong> 2.21 the inner <strong>and</strong> outer view <strong>of</strong> the datalogger<br />
are presented.<br />
Figure 2.20: Datalogger electronic circuits.<br />
The probe for the temperature measurement is a thermocouple stem <strong>of</strong> a diameter<br />
<strong>of</strong> 1 mm, with a mineral insulation <strong>and</strong> an AISI 310 stainless steel outer<br />
shell, stretching out from the box. The probe can measure a greatest temperature<br />
83