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Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA

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Experimental 83<br />

2.5 Datalogger<br />

This is a device for in situ real-time monitoring <strong>of</strong> the sample temperature <strong>and</strong><br />

electromagnetic field intensity during the microwave cure process.<br />

It consists <strong>of</strong> an hermetic aluminum box, containing electronic circuits, conveniently<br />

screened against electromagnetic interferences, with a radio absorbing<br />

trimming.<br />

The datalogger operation is based on a PIC18 Microchip, on which the s<strong>of</strong>tware<br />

for managing the acquisition, storage <strong>and</strong> transfer <strong>of</strong> the information to the PC is<br />

installed. In the Figures 2.20 <strong>and</strong> 2.21 the inner <strong>and</strong> outer view <strong>of</strong> the datalogger<br />

are presented.<br />

Figure 2.20: Datalogger electronic circuits.<br />

The probe for the temperature measurement is a thermocouple stem <strong>of</strong> a diameter<br />

<strong>of</strong> 1 mm, with a mineral insulation <strong>and</strong> an AISI 310 stainless steel outer<br />

shell, stretching out from the box. The probe can measure a greatest temperature<br />

83

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