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Kinetic Analysis and Characterization of Epoxy Resins ... - FedOA

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Introduction 51<br />

materials that have dielectric loss factors in the middle <strong>of</strong> the conductivity range,<br />

as illustrated in Figure 1.17.<br />

Figure 1.17: Relationship between the dielectric loss factor <strong>and</strong> ability to<br />

absorb microwave power for some common materials.<br />

In contrast, conventional heating transfers heat most efficiently to materials with<br />

high conductivity.<br />

Although equations 1.20 <strong>and</strong> 1.21 are useful for assessing the effect <strong>of</strong> electrical<br />

properties on microwave power absorption, material processing is much more complex.<br />

The dielectric properties are dependent on the mobility <strong>of</strong> the dipoles within<br />

the structure, <strong>and</strong> therefore the dielectric properties are functions <strong>of</strong> temperature,<br />

frequency, <strong>and</strong>, for reacting systems, degree <strong>of</strong> reaction. Therefore, the ability <strong>of</strong><br />

the material to absorb energy changes during processing. For example, at room<br />

temperature silicon carbide (SiC) has a loss factor <strong>of</strong> 1,71 at 2,45 GHz. The loss<br />

factor at 695 ◦ C for the same frequency is 27,99 [13].<br />

The phase shift <strong>of</strong> current in electrical circuits is analogous to how energy is<br />

dissipated in dielectric materials. As mentioned before, dipole polarization lags<br />

behind the electric field due to internal forces in the material. The phase shift,<br />

51

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