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RF MODULE

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Because the filter cutoff should be close to 1 GHz, and its distortion caused by PCB<br />

bending is small, it is necessary to sweep the frequency near the cutoff, from 750 MHz<br />

up to 1.5 GHz. The first solution step performs this sweep for the Electromagnetics<br />

application mode without any mechanical deformation. Then the same sweep is<br />

performed with a mechanical deformation from a uniform load of 40 N. The Solid,<br />

Stress-Strain application mode calculates the deformation, and the Moving Mesh<br />

application mode applies this deformation to the coordinate system that the<br />

Electromagnetic Waves application mode use. Due to the one-way coupling between<br />

the three application modes, the Solid, Stress-Strain and Moving Mesh application<br />

modes can be solved more efficiently using the segregated solver. After this step, the<br />

frequency sweep is performed again for the Electromagnetic Waves application mode<br />

using the parametric solver. It is possible to solve for all three application modes<br />

simultaneously with the segregated solver. Doing so is unnecessary because the Solid,<br />

Stress-Strain and Moving Mesh application modes are frequency independent.<br />

MICROWAVE FILTER ON PCB | 169

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