Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
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Texas Tech University, Nivetha Shivan, May 2012<br />
Figure 3.2: FC <strong>Assembly</strong> <strong>Process</strong> shows where Solder Flux is used [5]<br />
Flux- A (dipping version)<br />
� Dipping flux will cover <strong>the</strong> whole C4 area<br />
� The dipping flux toge<strong>the</strong>r with die attach is <strong>the</strong> common process for flip chip<br />
bonding. The material/process cost is lower and <strong>the</strong> productivity is higher.<br />
� The dipping only process usually has a little bit higher open/shorts problem for<br />
larger die size or high lead bump devices.<br />
Figure 3.3 shows <strong>the</strong> effects <strong>of</strong> Dipping Flux on C4 pads on <strong>the</strong> substrate.<br />
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