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Qualification of the Assembly Process of Flip-Chip BGA Packages ...

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Texas Tech University, Nivetha Shivan, May 2012<br />

angle. The moiré patterns are formed only when <strong>the</strong> package is curved or bent. If <strong>the</strong><br />

package is not curved, <strong>the</strong>n moiré fringes will not be produced.<br />

The moiré pattern is formed as a result <strong>of</strong> superimposing two images that have similar<br />

spatial frequencies. It contains bright and dark fringes. The bright fringes are produced<br />

when <strong>the</strong> etched lines on <strong>the</strong> glass plate fall directly on <strong>the</strong>ir shadows, similar to<br />

constructive interference. The dark fringes are produced when <strong>the</strong> etched lines on <strong>the</strong><br />

glass are out <strong>of</strong> phase with <strong>the</strong>ir own shadows, similar to destructive interference. Figure<br />

4.1 is an image <strong>of</strong> how a typical moiré fringe <strong>of</strong> a <strong>BGA</strong> package will look like. Figure 4.2<br />

explains <strong>the</strong> setup for <strong>the</strong> warpage measurement.<br />

Figure 4.1: Moiré Pattern <strong>of</strong> a <strong>BGA</strong> Package [12]<br />

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