Qualification of the Assembly Process of Flip-Chip BGA Packages ...

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Texas Tech University, Nivetha Shivan, May 2012 Figure 4.3: Sign Convention for Convex and Concave Warpage [14] This distance measurement follows an equation, which is Np � tan� � tan � z [13] (4.1) N is the fringe order that can be found from phase. It is given by: Where N = fringe order � = Phase value in the fringe patterns N � � / 2� [12] (4.2) The warpage measurement is computer controlled which retrieves information from camera, analyzes and stores it. The software called Akrometrix Studio 4.0 was used in this project to perform the analysis. The software employs a technique called phase-stepping which is used to convert the moiré fringes into 3-D surface plots. In this technique, the reference grating is moved from the package under measurement. By doing so, the moiré patterns that are produced become phase shifted. Three or more such phase shifted fringe patterns are produced. These fringe patterns are wrapped into a single phase image. The direction of package warpage is determined from the shifting in the fringes in the phase-stepping technique. Then, the software converts the phase image into the 3-D surface plot. Figure 4.4 shows 25
Texas Tech University, Nivetha Shivan, May 2012 the setup which is used for warpage measurement in real life. Figure 4.5 shows an example of 3-D surface plot generated in the computer. Figure 4.4: Setup for 3-D Contour plots Generation [15] Figure 4.5: An Example of a Typical 3-D Contour Plot [16] 26
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Page 11 and 12: 1.3 Requirements of an IC Package [
Page 13 and 14: 1.5.2 Tape Automated Bonding [4] Te
Page 15 and 16: 2.1 What is Qualification? [7] Texa
Page 23 and 24: 3.1.1.2 Underfill material [9] Texa
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Page 41 and 42: 4.2.3 Pressure Cooker Technique [20
Page 45 and 46: 4.3.1.3 Leakage Test Texas Tech Uni
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Qualification of the Assembly Process of Flip-Chip BGA Packages ...

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