Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
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Texas Tech University, Nivetha Shivan, May 2012<br />
APPENDIX B<br />
JESD22-A104C TEMPERATURE CYCLING<br />
Figure B.1: Representative temperature pr<strong>of</strong>ile for <strong>the</strong>rmal cycle test conditions<br />
Terms and Definitions used in Temperature Cycling<br />
Sample temperature (Ts)<br />
The temperature <strong>of</strong> <strong>the</strong> samples during temperature cycling as measured by<br />
<strong>the</strong>rmocouples.<br />
Nominal Ts (max)<br />
Nominal Ts (max) is <strong>the</strong> temperature <strong>of</strong> <strong>the</strong> sample required to meet <strong>the</strong> maximum<br />
nominal temperature for a specific test condition.<br />
Nominal Ts (min)<br />
Nominal Ts (min) is <strong>the</strong> temperature <strong>of</strong> <strong>the</strong> sample required to meet <strong>the</strong> minimum<br />
nominal temperature for a specific test condition.<br />
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