Qualification of the Assembly Process of Flip-Chip BGA Packages ...

Texas Tech University, Nivetha Shivan, May 2012
LIST OF TABLES
3.1 Difference between the Underfill Materials................................................................16
3.2 Design of the Experiments Conducted........................................................................17
3.3 Overall Pre-engineering Phase II Qualification plan...................................................17
3.4 Sample Size for a Maximum % Defective at a 90% Confidence Level[7].................21
4.1 MSL Levels [18]..........................................................................................................29
4.2 Temperature Cycle Test Conditions [19].....................................................................31
6.1 Stress Test Results from Phase I..................................................................................52
6.2 Maximum Warpage.....................................................................................................56
6.3 Measured Warpage across Temperature......................................................................56
6.4 Phase II Test Vehicles..................................................................................................58
6.5 Electrical Test Results at Time Zero............................................................................58
6.6 Electrical Test Results Post MSL3..............................................................................59
6.7 Electrical Test Results Post TCT.................................................................................60
6.8 Electrical Test Results Post PCT.................................................................................60
A.1 SnPb Eutectic Process - Package Peak Reflow Temperatures....................................66
A.2 Pb free Process - Package Peak Reflow Temperature................................................66
A.3 Classification Reflow Profiles....................................................................................66
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