Qualification of the Assembly Process of Flip-Chip BGA Packages ...

Texas Tech University, Nivetha Shivan, May 2012
4.2.1 MSL3 Pre-conditioning Technique……………………………........…....….….........28
4.2.2 Temperature Cycling Technique…………………………..........................................30
4.2.3 Pressure Cooker Technique……………………………………..………….…..…....32
4.3 Techniques used for verifying Device Functionality……………………....…..….32
4.3.1 Electrical Tests………………………...........................................................................32
4.4 Techniques used for examining Physical Failure Locations in Package….............37
4.4.1 C-mode Scanning Acoustic Microscopy Technique.....................................................37
4.4.2 Cross-sectional Analysis Technique..............................................................................43
5. PROCEDURE…………………………………………………....………….……..….49
5.1 Pre-engineering Qualification Phase I…………………………………....….…....49
5.2 Pre-engineering Qualification Phase II……………………………….….......…....51
6. DATA AND ANALYSIS…………………………………………………....………..52
6.1 Results…………………………………………………………………..….......….52
6.1.1 Pre-engineering Qualification Phase I…………. …………………….......................52
6.1.2 Pre-engineering Qualification Phase II…………………………...............................58
6.2 Data Analysis……………………………………….........................………….…60
7. CONCLUSION AND FUTURE WORK………………………………......................62
REFERENCES…………………………………………………………………....…......64
A. IPC/JEDEC J-STD-020 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION
FOR NON-HERMETIC SOLID STATE SURFACE MOUNT DEVICES.....................66
B. JESD22-A104C TEMPERATURE CYCLING............................................................68
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