Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
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Texas Tech University, Nivetha Shivan, May 2012<br />
Figure 4.21: SEM Image <strong>of</strong> Crack at Solder Joint between Solder Bump and Die<br />
4.4.2.4 Underfill quality inspection<br />
Figure 4.22: SEM Image <strong>of</strong> Voids in Solder Bump<br />
Figure 4.23 shows <strong>the</strong> SEM image <strong>of</strong> <strong>the</strong> underfill delaminating from <strong>the</strong> die. Figure 4.24<br />
shows a cross section image <strong>of</strong> crack in <strong>the</strong> die edge.<br />
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