Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
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Texas Tech University, Nivetha Shivan, May 2012<br />
Figure 3.6: FC <strong>Assembly</strong> <strong>Process</strong> - shows where Underfill is Used [5]<br />
There are two underfill materials that need to be considered for qualification. These are<br />
Underfill- A and Underfill-B. Table 3.1 shows <strong>the</strong> difference between <strong>the</strong> two underfill<br />
materials.<br />
Table 3.1: Difference between <strong>the</strong> Underfill Materials<br />
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