Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
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6.1.2 Pre-engineering <strong>Qualification</strong> Phase II<br />
Texas Tech University, Nivetha Shivan, May 2012<br />
Table 6.4 shows <strong>the</strong> test vehicles that were built for <strong>the</strong> second phase <strong>of</strong> Pre-engineering<br />
<strong>Qualification</strong>.<br />
Table 6.4: Phase II Test Vehicles<br />
TV1 and TV3 had DOE-1 materials in <strong>the</strong> package, whilst TV2 and TV4 had DOE-4<br />
materials in <strong>the</strong> package. Although TV1 and TV3 had <strong>the</strong> same materials in <strong>the</strong> package,<br />
<strong>the</strong> wafers used different technologies in <strong>the</strong> fabrication level. TV1 has an extra NSM<br />
layer while TV3 does not have. The same applies to TV-2 and TV-4 as well. Since Phase<br />
II <strong>of</strong> <strong>the</strong> qualification is more important than Phase I, <strong>the</strong> results <strong>of</strong> this phase has been<br />
dealt in detail.<br />
6.1.2.1 Stress Test Results<br />
Initial Electrical Test<br />
The four TVs were tested electrically at time zero. The results are shown in Table 6.5.<br />
Table 6.5: Electrical Test Results at Time Zero<br />
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