Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Qualification of the Assembly Process of Flip-Chip BGA Packages ...
Create successful ePaper yourself
Turn your PDF publications into a flip-book with our unique Google optimized e-Paper software.
Texas Tech University, Nivetha Shivan, May 2012<br />
APPENDIX A<br />
IPC/JEDEC J-STD-020 MOISTURE/REFLOW SENSITIVITY<br />
CLASSIFICATION FOR NON-HERMETIC SOLID STATE<br />
SURFACE MOUNT DEVICES<br />
Table A.1: SnPb Eutectic <strong>Process</strong> - Package Peak Reflow Temperatures<br />
Table A.2: Pb free <strong>Process</strong> - Package Peak Reflow Temperature<br />
Table A.3: Classification Reflow Pr<strong>of</strong>iles<br />
66
Change language