Qualification of the Assembly Process of Flip-Chip BGA Packages ...

Texas Tech University, Nivetha Shivan, May 2012
plan listed in Table 3.3. It is necessary to subject these 4 TVs to the remaining stresses
and correlate the decisions made from each step. It is only conclusive when a final
decision is made based on the analysis of the results of the all of the stress tests.
Lastly, TV3 also needs to pass the Engineering Qualification which uses the actual
product die with higher speed. Engineering Qualification has a similar stress test plan as
the Pre-engineering Qualification and also has essential read points. This way one
variable is introduced at each Qualification step which will lead to a number of cycles of
learning before we qualify the new interconnect technology for the new product.
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