Qualification of the Assembly Process of Flip-Chip BGA Packages ...

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Texas Tech University, Nivetha Shivan, May 2012 Figure 4.21: SEM Image of Crack at Solder Joint between Solder Bump and Die 4.4.2.4 Underfill quality inspection Figure 4.22: SEM Image of Voids in Solder Bump Figure 4.23 shows the SEM image of the underfill delaminating from the die. Figure 4.24 shows a cross section image of crack in the die edge. 47
Texas Tech University, Nivetha Shivan, May 2012 Figure 4.23: SEM Image showing Underfill Delamination The criteria for underfill delamination is
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QUALIFICATION OF THE ASSEMBLY PROCE
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Texas Tech University, Nivetha Shiv
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Page 11 and 12: 1.3 Requirements of an IC Package [
Page 13 and 14: 1.5.2 Tape Automated Bonding [4] Te
Page 15 and 16: 2.1 What is Qualification? [7] Texa
Page 23 and 24: 3.1.1.2 Underfill material [9] Texa
Page 41 and 42: 4.2.3 Pressure Cooker Technique [20
Page 45 and 46: 4.3.1.3 Leakage Test Texas Tech Uni
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Page 59 and 60: Cleaning Texas Tech University, Niv
Page 61 and 62: 6.1 Results Texas Tech University,
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Qualification of the Assembly Process of Flip-Chip BGA Packages ...

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