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CAD/CAM/CAE : electronic design automation, 1992 - Archive Server

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4-2 <strong>CAD</strong>/<strong>CAM</strong>/<strong>CAE</strong>—Electronic Design Automation Applications<br />

Figure 4-2<br />

North American PC Board Design Size<br />

PCB Board Design Size<br />

Less than 10 sq. inches<br />

10-19 sq. inches<br />

20-49 sq. inches<br />

50-99 sq. inches<br />

100-249 sq. inches<br />

250-499 sq. inches<br />

Greater than 500 sq. inches<br />

Source: Dataquest (October <strong>1992</strong>)<br />

Another factor contributing to the slow growth in PCB <strong>design</strong> tool<br />

growth is the lack of a widespread trend to decrease board size.<br />

While in the ASIC world, <strong>design</strong> start average gate densities continue<br />

to increase dramatically, requiring new productivity enhancement<br />

tools, Dataquest research has determined that board <strong>design</strong><br />

sizes will not dramatically decrease. While consumer and portable<br />

commtinication devices will drive sizes downward, increase the<br />

complexity, and cause radical form factor changes, this is limited to<br />

relatively few companies, and overall <strong>design</strong> sizes will not decrease<br />

dramatically, as shown in Figure 4-2.<br />

An emerging growth opportunity may be fotmd in the MCM market.<br />

While still in its infancy, Dataquest anticipates that this market<br />

will post strong growth in the coming years. The three basic types<br />

of MCMs these tools will be targeting are as follows:<br />

• MCM-L (Laminated)—^Fabricated using typical PCB processes and<br />

materials; targeted at low-end apphcations requiring interconnect<br />

densities of 50 to 150 cm/sq-cm at up to 100 to 200 MHz;<br />

favored by that automotive industry because of its relatively low<br />

cost; typically uses chip-on-board (COB) assembly, wire-bonded to<br />

the substrate, then encapsulated for protection.<br />

• MCM-C (Ceramic)—Ceramic substrates (both cofired and lowdielectric<br />

constant ceramics) offering economical intercoimect<br />

densities between 100 and 250 cm/sq-cm; traditional thick-film<br />

hybrid process; favored by the Aerospace and Mihtary sectors<br />

because of it ability to withstand harsh environments; COB<br />

and flip-chip assembly commonly used; metal encapsulated<br />

20 25<br />

Percentage of Those Responding<br />

30<br />

G2001689<br />

October 12,<strong>1992</strong> ©<strong>1992</strong> Dataquest Incorporated C<strong>CAM</strong>-EDA-MT-9201

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