CAD/CAM/CAE : electronic design automation, 1992 - Archive Server

The Board Dissected 4-5
abnormality, with their mean number of components per board
increasing slightly for their next generation designs.
Examining the components that make up today's printed circuit
boards, we see some startling changes. While usage of standard
microprocessors, ASICs, and other logic will remain relatively
constant, there will be an increased usage of high-density programmable
logic products, including complex programmable logic devices
(CPLDs) and field-programmable gate arrays (FPGAs), as shown in
Figures 4-6 and 4-7. The number of simple programmable logic
devices (SPLDs) used will decrease, as these devices will be integrated
into their higher capacity brethren.
Packaging
The increasing silicon capacity of microprocessors and ASIC devices
has mitigated the need for increased board sizes and the need to add
additional components. However, as the silicon becomes more complex,
the need to increase the input and output capacity of the
packages has required the development of a new breed of packaging
technology.
Figure 4-6
Component Makeup of Cvtrrent Generation Boards
NA:1
uP JPN:1.3
EUR:1
NA: 0.8
UC JPN:1.4
EUR: 1.1
NA: 0.8
DSP JPN:1.1
EUR: 0.6
NA: 7.0
PAL JPN: 8.5
EUR: 5.4
NA:1.3
CPLD JPN: 1.8
EUR: 1.6
1
Source: Dataquest (November 1992)
NA:1.4
FPGA JPN: 3.4
EUR: 1.5
-->_+_ NA: 3.0
uaie JPN; 3 8
Array EUR:I.8
NA:1.4
CBIC JPN: 7.2
EUR: 1.2
NA: 0.9
Custom JPN: 1.1
EUR: 0.7
*,"||?,9 Ti^i,
MOIO EUR: 0.7
Mixed- NA: 0.5
Signal JPN: 1-6
ASIC ^^"^°-'
Note: Numbers Denote Mear 1
Number of Components per
Board
Li Mill 1 1 1
G20O243O
CCAI\/I-EDA-UW-9201 ©1992 Dataquest incorporated November 30,1992