Integrated and Modular Systems for Commercial ... - Nonstop Systems

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4 Future ........ (cont’d) • device density and performance • system complexity and size • remote electronics: � end-to-end digitalization � interfacing & computing closer to data source or to point of application � “smart” sensors, actuators, skins, etc. • standard real-time operating systems � application transparency to hardware � strict partitioning ref.: M. Rodriguez, M. Stemig: “Evolution of embedded avionics operating systems”, presented at DASC-95, Boston/MA, Nov. ‘95, 5 pp. cont’d → ©1997 F.M.G. Dörenberg
5 Component and System Performance trends Note: curves not necessarily drawn to scale "now-ish" Processing & Memory Density ref.: G. Stix: "Toward 'point One' - Trends in Semiconductor Manufacturing," Scientific American, February 1995, pp. 90-95 ref.: G.D. Hutcheson, J.D. Hutcheson: "Technology and Economics in the Semiconductor Industry," Scientific American, January 1996, pp. 54-62 Level of Functional Integration Reliability System Cost Power Weight Volume time ©1997 F.M.G. Dörenberg
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Integrated and Modular Systems for
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Integrated and Modular Systems for
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Integrated and Modular Avionics •
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Engine thrust Structure & Gear Comp
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Why change avionics? • Airline/Op
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Operators seek revenue enhancement
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Why change avionics? (cont’d) •
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Why change avionics? (cont’d) •
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Avionics business • high-tech but
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Changing airtransport environment 1
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5000 Pax-km (billions, log-scale) 1
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Billions of 1995 US $ 80 60 40 20 9
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24% 23% 23% 30% 737-300 ($1834/hr)
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Big $ numbers life-time maintenance
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Save now and save later • increas
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Average schedule deviation costs de
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Integrated Modular Avionics Archite
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Fault Avoidance - prevent (by const
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Fault Tolerance Taxonomy Fault Tole
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Redundancy • Attributes: � form
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Basic ways to increase system relia
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1 System Reliability λunit = 5x10-
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Note: log-log scale F (t) 2-out-of-
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System architecture and design deci
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1.0 Rconfig(t) 0.9 0.8 dual Redunda
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Simplex Dual Triplex Quad Dual-Dual
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Integration is necessary because...
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Integration trend: Multi-Mode Recei
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Integration issues • “integrate
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Fault Tolerance for Safety, Reliabi
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Quant. Prob. 1 10-3 10-5 10-7 10-9
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Failure System Condition Design Ass
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Electro-Magnetic Interference (EMI)
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Req's for Fault Avoidance (incl. Co
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Standardization issues • “gener
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Resources Hardware Software Standar
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Integration & Modularization • LR
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O/S I/O Maint. BIT Appl. Total CPU
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Effect of integrating additional fu
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assumes integration of related func
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Integration & Modularization • Ot
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German “WW II” radios • Modul
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German “WW II” radios • Recei
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Modular Electronics: Not a New Conc
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Modular Electronics: Not a New Conc
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IMA - Integrated Modular Avionics L
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IMA Level-1 • LRUs re-packaged as
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IMA Level-4 & -5 • Level-4: funct
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Major Areas of Systems Integration
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ATC/ATM FMS Functional Integration
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ATC/ATM FMS Functional Integration
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Integrated Flight & Thrust Control
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Modular Flight Control & Guidance C
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FCGC redundancy management - exampl
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FCGC redundancy management - exampl
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lliedSignal A E R O S P A C E Allie
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lliedSignal A E R O S P A C E Berie
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lliedSignal A E R O S P A C E Kiev
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AlliedSignal h/w AlliedSignal h/w +
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lliedSignal A E R O S P A C E ARIA-
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minus database flash memory minus D
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lliedSignal A E R O S P A C E Two I
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lliedSignal A E R O S P A C E Hazar
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lliedSignal A E R O S P A C E Hazar
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lliedSignal A E R O S P A C E 12,00
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lliedSignal A E R O S P A C E 20 15
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lliedSignal A E R O S P A C E CFIT
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lliedSignal A E R O S P A C E Terra
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lliedSignal A E R O S P A C E ref.:
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lliedSignal A E R O S P A C E Pink:
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lliedSignal A E R O S P A C E ≤
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lliedSignal A E R O S P A C E IHAS:
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lliedSignal A E R O S P A C E Stick
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Page 209 and 210: 1 Integrated and Modular Avionics
Page 211: 3 FANS: Future Air Navigation Syste
Page 215 and 216: 7 Component and System Performance
Page 217 and 218: 9 Future ........ (cont’d) • im
Page 219 and 220: 11 150 k ↑ Total airplane signal
Page 221 and 222: 13 100 MB 80 MB 20 MB 10 MB 747-200
Page 223 and 224: 15 System Complexity and Size Typic
Page 225 and 226: 17 Given: Extrapolation ...... •
Page 227 and 228: 19 Enabling technologies - componen
Page 229 and 230: Enabling technologies - drivers for
Page 231 and 232: 23 Enabling technologies - design /
Page 233 and 234: 25 236-pin connector Example: PC mo
Page 235 and 236: 27 Example: integrated X-band power
Page 237 and 238: 29 Cold-Cathode Field Emission Disp
Page 239 and 240: 31 Enabling technologies - componen
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Page 243 and 244: 35 Enabling technologies - communic
Page 245 and 246: 37 High Medium Low Enabling technol
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Page 249 and 250: 1 BOOKS BIBLIOGRAPHY F.J. Redmill (
Page 251 and 252: 3 M.L. Shooman: "A study of occurre
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