Integrated and Modular Systems for Commercial ... - Nonstop Systems

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Enabling technologies
- components -
� integration (incl. RF)
� miniaturization, high-density packaging,
improved chip-to-package size efficiency
(Multi Chip Module, Chip-On-Board, Flip-Chip,
Chip-Scale- Package, 3-D stacking, etc.)
� high temperature electronics (THE, e.g. SiC)
� fault-tolerant electronics (FTE), chip-level
redundancy
� chip & inter-chip BIT
ref.: G. Derman: “Interconnects & Packaging - Part 1: Chip-Scale Packages”, EE Times, 26 Feb. ‘96, pp. 41,70-72
ref.: T. DiStefano, R. Marrs: “Building on the surface-mount infrastructure”, EE Times, 26 Feb. ‘96, pp. 49
ref.: HITEN (High Temp. Electronics Network)“Aerospace applications of High Temperature Electronics”, 13 May ‘96, http://www.hiten.com/hiten/categories/aero
ref.: S. Birch: “The hot issue of aerospace electronics”, SAE Aerospace Engineering, July ‘95, pp. 4-6
ref.: J.A. Sparks: “High temperature electronics for aerospace applications”, proc. ERA Avionics Conf., London,Nov./Dec. ‘94, pp. 8.2.1-8.2.5
©1997 F.M.G. Dörenberg