RTL8181 Wireless LAN Access Point/Gateway Controller DATA ...

RTL8181Package outline for TFBGA 292 BALL(17*17 mm)1. CONTROLLING DIMENSION : MILLIMETER2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THESymbol Dimension in mm Dimension in inch SPHERICAL CROWNS OF THE SOLDER BALLS.Min Nom Max Min Nom Max 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALLA --- --- 1.30 --- --- 0.051 DIAMETER, PARALLEL TO PRIMARY DATUM C.A1 0.25 0.30 0.35 0.010 0.012 0.014 4. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THEA2 0.84 0.89 0.94 0.033 0.035 0.037 EDGE OF THE SOLDER BALL AND THE BODY EDGE.c 0.32 0.36 0.40 0.013 0.014 0.016 5. REFERENCE DOCUMENT : JEDEC MO-205.D 16.90 17.00 17.10 0.665 0.669 0.673 6. THE PATTERN OF PIN 1 FIDUCIAL IS FOR REFERENCE ONLY.E 16.90 17.00 17.10 0.665 0.669 0.673D1 --- 15.20 --- --- 0.598 ---E1 --- 15.20 --- --- 0.598 ---e --- 0.80 --- --- 0.031 ---b 0.35 0.40 0.45 0.014 0.016 0.018 TITLE : 292LD TFBGA ( 17x17mm) PACKAGE OUTLINEaaa 0.10 0.004bbb 0.10 0.004 SUBSTRATE MATERIAL: BT RESINccc 0.12 0.005 APPR. DWG NO..ddd 0.15 0.006 ENG. Rev NOeee 0.08 0.003 QM. PRODUCT CODEMD/ME 20/20 20/20 CHK . DATE.DWG.SHT No.REALTEK SEMI-CONDUCTOR CO., LTD50CONFIDENTIAL v1.0