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ANNEX I Schedule of Brunei Darussalam Headnote ... - SICE

ANNEX I Schedule of Brunei Darussalam Headnote ... - SICE

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Annex I: <strong>Brunei</strong> Darusslam's Tariff <strong>Schedule</strong>HS CODE DESCRIPTION BASERATE8466.10.20 - - Parts for machines for sawing monocrystalsemiconductor boules into slices, or wafers into chips, parts<strong>of</strong> dicing machines for scribing or scoring semiconductorwafers, parts for lasercutters for cutting tracks insemiconductor production by laser beam2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 ENDDATE0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.10.90 - - Other 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.20.10 - - For the machine-tools <strong>of</strong> subheadings 8456.99.20,8456.99.30, 8456.99.40, 8460.31.10, 8465.91.10, 8465.92.10,8465.95.10 and 8465.99.500% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.20.20 - - Parts for machines for sawing monocrystalsemiconductor boules into slices, or wafers into chips; parts<strong>of</strong> dicing machines for scribing or scoring semiconductorwafers; parts <strong>of</strong> lasercutters for cutting contacting tracks insemiconductor production by laser beam; parts <strong>of</strong>apparatus for stripping or cleaning semiconductor wafers0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.20.30 - - Parts <strong>of</strong> apparatus for wet etching, developing, strippingor cleaning semiconductor wafers and flat panel displays0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.20.90 - - Other 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.30.10 - - For the machine-tools <strong>of</strong> subheadings 8456.99.20,8456.99.30, 8456.99.40, 8460.31.10, 8465.91.10, 8465.92.10,8465.95.10 and 8465.99.500% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.30.20 - - Parts for machines for sawing monocrystalsemiconductor boules into slices, or wafers into chips; parts<strong>of</strong> dicing machines for scribing or scoring semiconductorwafers; parts <strong>of</strong> lasercutters for cutting contacting tracks insemiconductor production by laser beam; parts <strong>of</strong>apparatus for stripping or cleaning semiconductor wafers0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.30.30 - - Parts <strong>of</strong> apparatus for wet etching, developing, strippingor cleaning semiconductor wafers and flat panel displays0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.30.90 - - Other 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.91.10 - - - Parts <strong>of</strong> machines for sawing monocrystalsemiconductor boules into slices, or wafers into chips; parts<strong>of</strong> grinding, polishing and lapping machines for processing<strong>of</strong> semiconductor wafers; parts <strong>of</strong> dicing machines forscribing or scoring semiconductor wafers; parts <strong>of</strong>apparatus for wet etching, developing, stripping orcleaning semiconductor wafers and flat panel displays0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.91.90 - - - Other 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.92.10 - - - For subheading 8465.91.10, 8465.92.10, 8465.95.10, 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068465.99.508466.92.90 - - - Other 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.93.10 - - - For subheadings 8456.10.10, 8456.91.00 and 8456.99.10 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.93.20 - - - For subheading 8456.99.20, 8456.99.30, 8456.99.40 and8460.31.108466.93.30 - - - Jigs and fixtures used only for the assembly <strong>of</strong> roadvehicles0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20060% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 20068466.93.90 - - - Other 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 0% 2006I-BN-183

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