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METHODOLOGY
Description of Apparatus
To achieve the desired outcomes, various
apparatus are required, namely for diffusion
bonding and post‐bond heat treatment.
Apparatus for Diffusion Bonding
The apparatus for diffusion bonding is de‐
signed to provide compressive loading (pressing)
and heating in a vacuum at the interface of a
specimen to be joined. The configuration of the
working part of the apparatus is shown at Fig. 3.
Apparatus for Post‐Bond Heat Treatment
This apparatus is designed to carry out post‐
bond heat treatment for further diffusion
processes to takes place in the diffusion cou‐
ples obtained by diffusion bonding. A sche‐
matic drawing of the annealing furnace, vac‐
uum chamber, specimen and its mounting is
shown in Fig. 5.
MIMET Technical Bulletin Volume 1 (2) 2010
Materials and Specimen Preparation for Diffu‐
sion Bonding.
Materials used in this study as parent metals
are commercial grade aluminum and steel with
various carbon contents. These materials are
cut in a lathe to cylindrical specimen of sizes;
12 mm diameter by 10 mm length, and 14 mm
diameter by 20 mm length for metallographic
observation and tensile test specimens respec‐
tively. This specimen and their assembly are
shown in Fig. 6 and Fig.7 respectively. 4.3
Bonding Procedure
The specimens are positioned in the apparatus
as shown in Fig. 3. The temperature used for the
metallographic specimens is 600°C and for tensile
specimen are 500°C, 550°C and 600°C. The bonding
of these specimens is conducted under a dynamic
vacuum pressure of the order of 10‐2 Torr for 30
minute with bonding pressure of 0.5 kgf/mm.
| MARINE FRONTIER @ UniKL
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