Hardware Interface Description - KORE Telematics
Hardware Interface Description - KORE Telematics
Hardware Interface Description - KORE Telematics
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XT55/56 <strong>Hardware</strong> <strong>Interface</strong> <strong>Description</strong><br />
Confidential / Released<br />
s<br />
7.3 Board-to-board connector<br />
This chapter provides specifications for the 80-pin board-to-board connector which serves as<br />
physical interface to the host application. The receptacle assembled on the XT55/56 PCB is<br />
type Hirose DF12C. Mating headers from Hirose are available in different stacking heights.<br />
Table 37: Ordering information DF12 series<br />
Item Part number Stacking<br />
height (mm)<br />
HRS number<br />
Receptacle on XT55/56 DF12C(3.0)-80DS-0.5V(81) 3.0 537-0733-9-81<br />
Headers DF12 series<br />
DF12D(3.0)-80DP-0.5V(81)<br />
DF12E(3.0)-80DP-0.5V(81)<br />
3.0<br />
3.0<br />
537-0803-2-81<br />
537-0838-7-81<br />
Notes: The headers listed above are without boss and metal fitting. Please contact Hirose for details<br />
on other types of mating headers. Asterixed HRS numbers denote different types of packaging.<br />
Table 38: Electrical and mechanical characteristics of the Hirose DF12C connector<br />
Parameter<br />
Specification (80 pin board-to-board connector)<br />
Number of contacts 80<br />
Quantity delivered<br />
2000 connectors per tape & reel<br />
Voltage<br />
50V<br />
Rated current<br />
0.3A max per contact<br />
Resistance<br />
0.05 Ohm per contact<br />
Dielectric withstanding voltage 500V RMS min<br />
Operating temperature<br />
-45°C...+125°C<br />
Contact material<br />
phosphor bronze (surface: gold plated)<br />
Insulator material<br />
PA , beige natural<br />
Stacking height<br />
3.0 mm<br />
Insertion force 21.8N<br />
Withdrawal force 1 st<br />
10N<br />
Withdrawal force 50 th<br />
10N<br />
Maximum connection cycles 50<br />
XT55/56_hd_v02.06a Page 114 of 125 17.12.2004