Chia Yu Lin and Steven L. Manley. Bromoform production from - ASLO

MNS Keynote Lecture
Thomas W. Kenny
Stanford University
Wednesday, August 31, 2011 Session: MNS 8
10:40am–12:00pm Location: Regency C
Encapsulation for MEMS Resonators: How Packaging
Enabled a Technology
MEMS Resonators have been studied for more than 40 years,
with continuous interest in their use as frequency references.
Unfortunately, the promise of MEMS resonators for these
applications has always been limited by observations of drift in
frequency, which has been understood to arise from the
temperature coefficient of the modulus of Silicon, as well as the
role of adsorbed molecules from the environment of the
resonator and other nefarious effects. The temperature
coefficient of the modulus of Silicon is a well-known parameter,
giving rise to a ~30 ppm/C error in frequency. This error can be
reduced by temperature control of the resonator, and by use of
compensating materials, such as SiO2, or by electronic
compensation methods. The adsorbate-induced drift in MEMS
resonators can only be addressed by the development of ultraclean,
hermetic packaging for the resonators. Our group has
developed a wafer-scale MEMS encapsulation process that
enables a solution to many of these problems with MEMS
resonators. In this presentation, we will discuss the
encapsulation process, and the opportunities for
implementation of temperature compensation and control. The
encapsulation process is inherently clean, and directly enables
long-term stability. Taken together, we believe we have a
pathway to the development of high-performance frequency
sources that feature excellent long-term stability and
temperature stability, and which can be considered for
commercial and defense applications.
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KEYNOTE AND AWARD LECTURES
Biographical Description: Thomas W. Kenny received the
B.S. degree in physics from the University of Minnesota,
Minneapolis, in 1983, and the M.S. and Ph.D. degrees in
physics from the University of California, Berkeley, in 1987 and
1989, respectively. From 1989 to 1993, he was with the Jet
Propulsion Laboratory, National Aeronautics and Space
Administration, Pasadena, CA, where his research focused on
the development of electron-tunneling high-resolution
microsensors. In 1994, he joined the Department of Mechanical
Engineering, Stanford University, Stanford, CA, where he directs
Microsensor-based research in a variety of areas, including
resonators, wafer-scale packaging, cantilever beam force
sensors, microfluidics, and novel fabrication techniques for
micro-mechanical structures. He is the Founder and CTO of
Cooligy, Sunnyvale, CA, a microfluidics chip cooling component
manufacturer, and the Founder and a Board Member of SiTime
Corporation, a developer of CMOS timing references using
MEMS resonators. He is currently a Stanford Bosch Faculty
Development Scholar and was the General Chairman of the
2006 Hilton Head Solid State Sensor, Actuator, and
Microsystems Workshop. From October 2006 through
September 2010, he was on leave to serve as Program
Manager in the Microsystems Technology Office at the Defense
Advanced Research Projects Agency, starting and managing
programs in thermal management, nanomanufacturing,
manipulation of Casimir forces, and the Young Faculty Award.
He has authored or coauthored over 250 scientific papers and
is a holder of 48 issued patents.