Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

More documents

Recommendations

Info

Electrical characteristicsSTM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDFigure 30.ADC accuracy characteristics4095409440937654321V[1LSB REF+IDEAL =4096E OV(or DDAdepending on package)]4096E T1LSB IDEAL(2)E L(3)E D(1)E G(1) Example of an actual transfer curve(2) The ideal transfer curve(3) End point correlation lineE T =Total Unadjusted Error: maximum deviationbetween the actual and the ideal transfer curves.E O =Offset Error: deviation between the first actualtransition and the first ideal one.E G =Gain Error: deviation between the last idealtransition and the last actual one.E D =Differential Linearity Error: maximum deviationbetween actual steps and the ideal one.E L =Integral Linearity Error: maximum deviationbetween any actual transition and the end pointcorrelation line.0V SSA1 2 3 4 5 6 7 4093 4094 4095 4096V DDAai14395bFigure 31.Typical connection diagram using the ADC 1. Refer to Table 59 for the values of R AIN , R ADC and C ADC .2. C parasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus thepad capacitance (roughly 7 pF). A high C parasitic value will downgrade conversion accuracy. To remedythis, f ADC should be reduced.104/124 Doc ID 022268 Rev 2
STM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDElectrical characteristicsFigure 32.Maximum dynamic current consumption on V REF+ supply pin during ADCconversionSampling (n cycles)Conversion (12 cycles)ADC clock700µAI ref+300µATable 61. R AIN max for f ADC = 16 MHz (1)Ts(cycles)Ts(µs)R AIN max (kΩ)Multiplexed channelsDirect channels2.4 V < V DDA < 3.6 V 1.8 V < V DDA < 2.4 V 2.4 V < V DDA < 3.3 V 1.8 V < V DDA < 2.4 V4 0.25 Not allowed Not allowed 0.7 Not allowed9 0.5625 0.8 Not allowed 2.0 1.016 1 2.0 0.8 4.0 3.024 1.5 3.0 1.8 6.0 4.548 3 6.8 4.0 15.0 10.096 6 15.0 10.0 30.0 20.0192 12 32.0 25.0 50.0 40.0384 24 50.0 50.0 50.0 50.01. Guaranteed by design, not tested in production.General PCB design guidelinesPower supply decoupling should be performed as shown in Figure 33 or Figure 34,depending on whether V REF+ is connected to V DDA or not. The 10 nF capacitors should beceramic (good quality). They should be placed as close as possible to the chip.Doc ID 022268 Rev 2 105/124
Page 1 and 2:
STM32L162VD STM32L162ZDSTM32L162QD
Page 3 and 4:
STM32L162VD, STM32L162ZD, STM32L162
Page 6:
List of tablesSTM32L162VD, STM32L16
Page 9 and 10:
Page 11 and 12:
Page 13 and 14:
Page 15 and 16:
Page 17 and 18:
Page 19 and 20:
Page 21 and 22:
Page 24 and 25:
Functional overviewSTM32L162VD, STM
Page 26 and 27:
Functional overviewSTM32L162VD, STM
Page 28 and 29:
Pin descriptionsSTM32L162VD, STM32L
Page 30 and 31:
Page 32 and 33:
Page 34 and 35:
Page 36 and 37:
Page 38 and 39:
38/124 Doc ID 022268 Rev 2Table 6.P
Page 40 and 41:
Page 42 and 43:
Page 44 and 45:
Page 46 and 47:
Page 48 and 49:
Electrical characteristicsSTM32L162
Page 50 and 51:
Page 52 and 53:
Page 54 and 55: Electrical characteristicsSTM32L162
Page 114 and 115: Package characteristicsSTM32L162VD,
Page 122 and 123: Ordering information schemeSTM32L16
Page 124: STM32L162VD, STM32L162ZD, STM32L162
show all

Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

Create successful ePaper yourself

Delete template?

Save as template?