Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

More documents

Recommendations

Info

Package characteristicsSTM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDTable 72. WLCSP64, 0.400 mm pitch wafer level chip size package mechanical datamillimeters inches (1)SymbolMin Typ Max Min Typ MaxA 0.520 0.570 0.620 0.0205 0.0224 0.0244A1 0.170 0.190 0.210 0.0067 0.0075 0.0083A2 0.350 0.380 0.410 0.0138 0.0150 0.0161b 0.240 0.270 0.300 0.0094 0.0106 0.0118D 4.519 4.539 4.559 0.1779 0.1787 0.1795E 4.891 4.911 4.931 0.1926 0.1933 0.1941e 0.400 0.0157e1 2.800 0.1102F 0.870 0.0342G 1.056 0.0416eee 0.050 0.00201. Values in inches are converted from mm and rounded to 4 decimal digits.120/124 Doc ID 022268 Rev 2
STM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDPackage characteristics7.2 Thermal characteristicsThe maximum chip-junction temperature, T J max, in degrees Celsius, may be calculatedusing the following equation:Where:T J max = T A max + (P D max × Θ JA )● T A max is the maximum ambient temperature in ° C,●●●Θ JA is the package junction-to-ambient thermal resistance, in ° C/W,P D max is the sum of P INT max and P I/O max (P D max = P INT max + P I/O max),P INT max is the product of I DD and V DD , expressed in Watts. This is the maximum chipinternal power.P I/O max represents the maximum power dissipation on output pins where:P I/O max = Σ (V OL × I OL ) + Σ((V DD – V OH ) × I OH ),taking into account the actual V OL / I OL and V OH / I OH of the I/Os at low and high level in theapplication.Table 73.Thermal characteristicsSymbol Parameter Value UnitThermal resistance junction-ambientLQFP144 - 20 x 20 mm / 0.5 mm pitch40Θ JAThermal resistance junction-ambientBGA132 - 7 x 7 mmThermal resistance junction-ambientLQFP100 - 14 x 14 mm / 0.5 mm pitch6043°C/WThermal resistance junction-ambientLQFP64 - 10 x 10 mm / 0.5 mm pitch467.2.1 Reference documentJESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - NaturalConvection (Still Air). Available from www.jedec.org.Doc ID 022268 Rev 2 121/124
Page 1 and 2:
STM32L162VD STM32L162ZDSTM32L162QD
Page 3 and 4:
STM32L162VD, STM32L162ZD, STM32L162
Page 6:
List of tablesSTM32L162VD, STM32L16
Page 9 and 10:
Page 11 and 12:
Page 13 and 14:
Page 15 and 16:
Page 17 and 18:
Page 19 and 20:
Page 21 and 22:
Page 24 and 25:
Functional overviewSTM32L162VD, STM
Page 26 and 27:
Functional overviewSTM32L162VD, STM
Page 28 and 29:
Pin descriptionsSTM32L162VD, STM32L
Page 30 and 31:
Page 32 and 33:
Page 34 and 35:
Page 36 and 37:
Page 38 and 39:
38/124 Doc ID 022268 Rev 2Table 6.P
Page 40 and 41:
Page 42 and 43:
Page 44 and 45:
Page 46 and 47:
Page 48 and 49:
Electrical characteristicsSTM32L162
Page 50 and 51:
Page 52 and 53:
Page 54 and 55:
Page 56 and 57:
Page 58 and 59:
Page 60 and 61:
Page 62 and 63:
Page 64 and 65:
Page 66 and 67:
Page 68 and 69:
Page 70 and 71: Electrical characteristicsSTM32L162
Page 114 and 115: Package characteristicsSTM32L162VD,
Page 122 and 123: Ordering information schemeSTM32L16
Page 124: STM32L162VD, STM32L162ZD, STM32L162
show all

Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

Create successful ePaper yourself

Delete template?

Save as template?