Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

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Electrical characteristicsSTM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDNote:Caution:For C L1 and C L2 , it is recommended to use high-quality ceramic capacitors in the 5 pF to15 pF range selected to match the requirements of the crystal or resonator (see Figure 14).C L1 and C L2, are usually the same size. The crystal manufacturer typically specifies a loadcapacitance which is the series combination of C L1 and C L2 .Load capacitance C L has the following formula: C L = C L1 x C L2 / (C L1 + C L2 ) + C stray whereC stray is the pin capacitance and board or trace PCB-related capacitance. Typically, it isbetween 2 pF and 7 pF.To avoid exceeding the maximum value of C L1 and C L2 (15 pF) it is strongly recommendedto use a resonator with a load capacitance C L ≤7 pF. Never use a resonator with a loadcapacitance of 12.5 pF.Example: if you choose a resonator with a load capacitance of C L = 6 pF and C stray = 2 pF,then C L1 = C L2 = 8 pF.Figure 14.Typical application with a 32.768 kHz crystal 70/124 Doc ID 022268 Rev 2
STM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDElectrical characteristics6.3.6 Internal clock source characteristicsThe parameters given in Table 27 are derived from tests performed under ambienttemperature and V DD supply voltage conditions summarized in Table 10.High-speed internal (HSI) RC oscillatorTable 27.HSI oscillator characteristicsSymbol Parameter Conditions Min Typ Max Unitf HSI Frequency V DD = 3.0 V 16 MHzTRIM (1)(2)(2)ACC HSIt (2)SU(HSI)(2)I DD(HSI)HSI user-trimmedresolutionAccuracy of thefactory-calibratedHSI oscillatorHSI oscillatorstartup timeHSI oscillatorpower consumptionTrimming code is not a multiple of 16 ± 0.4 0.7 %Trimming code is a multiple of 16 ± 1.5 %V DDA = 3.0 V, T A = 25 °C -1 (3)1 (3) %V DDA = 3.0 V, T A = 0 to 55 °C -1.5 1.5 %V DDA = 3.0 V, T A = -10 to 70 °C -2 2 %V DDA = 3.0 V, T A = -10 to 85 °C -2.5 2 %V DDA = 3.0 V, T A = -10 to 105 °C -4 2 %V DDA = 1.65 V to 3.6 VT A = -40 to 105 °C-4 3 %3.7 6 µs100 140 µA1. The trimming step differs depending on the trimming code. It is usually negative on the codes which aremultiples of 16 (0x00, 0x10, 0x20, 0x30...0xE0).2. Based on characterization, not tested in production.3. Tested in production.Low-speed internal (LSI) RC oscillatorTable 28.LSI oscillator characteristicsSymbol Parameter Min Typ Max Unitf LSI(1)D LSI(2)t su(LSI)(3)1. Tested in production.LSI frequency 26 38 56 kHzLSI oscillator frequency drift0°C ≤T A ≤ 85°C-10 4 %LSI oscillator startup time 200 µsI DD(LSI)(3) LSI oscillator power consumption 400 510 nA2. This is a deviation for an individual part, once the initial frequency has been measured.3. Guaranteed by design, not tested in production.Doc ID 022268 Rev 2 71/124
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STM32L162VD STM32L162ZDSTM32L162QD
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STM32L162VD, STM32L162ZD, STM32L162
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List of tablesSTM32L162VD, STM32L16
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Page 19 and 20: STM32L162VD, STM32L162ZD, STM32L162
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Page 24 and 25: Functional overviewSTM32L162VD, STM
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Page 28 and 29: Pin descriptionsSTM32L162VD, STM32L
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Page 48 and 49: Electrical characteristicsSTM32L162
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Package characteristicsSTM32L162VD,
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Ordering information schemeSTM32L16
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Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

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