Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

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Electrical characteristicsSTM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDTable 62.dOffset/dT (1) Offset error temperaturecoefficient (code 0x800)V DDA = 3.3VV REF+ = 3.0VT A = 0 to 50 ° CDAC output buffer OFFV DDA = 3.3VV REF+ = 3.0VT A = 0 to 50 ° CDAC output buffer ONGain (1) Gain error (7) DAC output buffer ONC L ≤ 50 pF, R L ≥ 5 kΩdGain/dT (1)TUE (1)t SETTLINGUpdate ratet WAKEUPDAC characteristics (continued)Symbol Parameter Conditions Min Typ Max UnitGain error temperaturecoefficientTotal unadjusted errorNo R LOAD , C L ≤ 50 pFDAC output buffer OFFV DDA = 3.3VV REF+ = 3.0VT A = 0 to 50 ° CDAC output buffer OFFV DDA = 3.3VV REF+ = 3.0VT A = 0 to 50 ° CDAC output buffer ONC L ≤ 50 pF, R L ≥ 5 kΩDAC output buffer ONNo R LOAD , C L ≤ 50 pFDAC output buffer OFF-20 -10 00 20 50+0.1 / -0.2% +0.2 / -0.5%+0 / -0.2% +0 / -0.4%-10 -2 0-40 -8 012 308 12Settling time (full scale: fora 12-bit code transitionbetween the lowest andCthe highest input codes till L ≤ 50 pF, R L ≥ 5 kΩ 7 12 µsDAC_OUT reaches finalvalue ±1LSBµV/°C%µV/°CMax frequency for acorrect DAC_OUT change(95% of final value) with 1 C L ≤ 50 pF, R L ≥ 5 kΩ 1 MspsLSB variation in the inputcodeWakeup time from offstate (setting the ENx bitin the DAC ControlC L ≤ 50 pF, R L ≥ 5 kΩ 9 15 µsregister) (8)VPSRR+ DDA supply rejection ratioC(static DC measurement) L ≤ 50 pF, R L ≥ 5 kΩ -60 -35 dB1. Data based on characterization results.2. Connected between DAC_OUT and V SSA .3. Difference between two consecutive codes - 1 LSB.4. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 andlast Code 4095.LSB108/124 Doc ID 022268 Rev 2
STM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDElectrical characteristics5. Difference between the value measured at Code (0x800) and the ideal value = V REF+ /2.6. Difference between the value measured at Code (0x001) and the ideal value.7. Difference between ideal slope of the transfer function and measured slope computed from code 0x000 and0xFFF when buffer is OFF, and from code giving 0.2 V and (V DDA – 0.2) V when buffer is ON.8. In buffered mode, the output can overshoot above the final value for low input code (starting from min value).Figure 35.12-bit buffered /non-buffered DACBuffered/Non-buffered DACBuffer(1)12-bitdigital toanalogconverterDACx_OUTR LOADC LOAD1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directlywithout the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in theDAC_CR register.6.3.19 Operational amplifier characteristicsTable 63.Operational amplifier characteristicsSymbol Parameter Condition (1) Min (2) Typ Max (2) Unitai17157CMIR Common mode input range 0 V DDVI OFFSETΔVI OFFSETI IBI LOADI DDCMRRPSRRInput offset voltageInput offset voltagedriftInput current biasDrive currentConsumptionCommon moderejection rationPower supplyrejection ratioMaximumcalibration rangeAfter offsetcalibration±15±1.5Normal mode ±40 µV/°CLow power mode ±80Dedicated inputGeneral purposeinput75 °CNormal mode 500Low power mode 100Normal mode No load,100 220Low power mode quiescent mode30 60Normal mode -85Low power mode -90Normal mode-85DCLow power mode -90110mVnAµAµAdBdBDoc ID 022268 Rev 2 109/124
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STM32L162VD STM32L162ZDSTM32L162QD
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STM32L162VD, STM32L162ZD, STM32L162
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List of tablesSTM32L162VD, STM32L16
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Functional overviewSTM32L162VD, STM
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Functional overviewSTM32L162VD, STM
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Pin descriptionsSTM32L162VD, STM32L
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38/124 Doc ID 022268 Rev 2Table 6.P
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Electrical characteristicsSTM32L162
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Page 122 and 123: Ordering information schemeSTM32L16
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Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

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