Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil
Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil
Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil
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Package characteristicsSTM<strong>32</strong>L162VD, STM<strong>32</strong>L162ZD, STM<strong>32</strong>L162QD, STM<strong>32</strong>L162RDFigure 42.UFBGA1<strong>32</strong>, 7 x 7 mm, 1<strong>32</strong>-ball ultra thin, fine-pitch ball grid array packageoutlineA1 BallPad CornerDetail A2Top viewSide viewA1 Ball Pad Corner1Detail Arotated 90°Seating planeBottom view1. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.Table 71. UFBGA1<strong>32</strong> package mechanical datamillimeters inches (1)SymbolMin Typ Max Min Typ MaxA 0.46 0.53 0.60 0.0181 0.0209 0.0236A1 0.05 0.08 0.11 0.0020 0.00<strong>32</strong> 0.0043A2 0.40 0.45 0.50 0.0157 0.0177 0.0197b 0.17 0.28 0.33 0.0067 0.0110 0.01301. Values in inches are converted from mm and rounded to 4 decimal digits.118/124 Doc ID 022268 Rev 2
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