Ultralow power ARM-based 32-bit MCU with 384 Kbytes Flash ... - Keil

STM32L162VD, STM32L162ZD, STM32L162QD, STM32L162RDPackage characteristics7.2 Thermal characteristicsThe maximum chip-junction temperature, T J max, in degrees Celsius, may be calculatedusing the following equation:Where:T J max = T A max + (P D max × Θ JA )● T A max is the maximum ambient temperature in ° C,●●●Θ JA is the package junction-to-ambient thermal resistance, in ° C/W,P D max is the sum of P INT max and P I/O max (P D max = P INT max + P I/O max),P INT max is the product of I DD and V DD , expressed in Watts. This is the maximum chipinternal power.P I/O max represents the maximum power dissipation on output pins where:P I/O max = Σ (V OL × I OL ) + Σ((V DD – V OH ) × I OH ),taking into account the actual V OL / I OL and V OH / I OH of the I/Os at low and high level in theapplication.Table 73.Thermal characteristicsSymbol Parameter Value UnitThermal resistance junction-ambientLQFP144 - 20 x 20 mm / 0.5 mm pitch40Θ JAThermal resistance junction-ambientBGA132 - 7 x 7 mmThermal resistance junction-ambientLQFP100 - 14 x 14 mm / 0.5 mm pitch6043°C/WThermal resistance junction-ambientLQFP64 - 10 x 10 mm / 0.5 mm pitch467.2.1 Reference documentJESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - NaturalConvection (Still Air). Available from www.jedec.org.Doc ID 022268 Rev 2 121/124