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Tech Hardware Supply Chain - Gazhoo

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Bhavin Shah<br />

(852) 2800-8538<br />

bhavin.a.shah@jpmorgan.com<br />

China, and so far, it is limited to a few components for Samsung and ODM for LG.<br />

We expect these two companies to scale back their original manufacturing<br />

outsourcing plans in 2009 as: (1) the significantly weak Won appears to be offsetting<br />

cost advantages in outsourcing; and (2) fulfilling their own production capacity<br />

should be a priority in view of a weak unit shipment outlook.<br />

Table 51: EMS/mechanical component outsourcing opportunities from major handset players<br />

Vendor EMS/mechanical component outsourcing potential<br />

Nokia PCBA: Limited opportunity as Nokia is expanding own PCBA capacity.<br />

Module assembly: All module assembly has been outsourced.<br />

System assembly: Final system assembly will remain in-house in the near future, but could open up in the future.<br />

Overall opportunity comes from allocation reshuffle from less efficient clusters to more efficient ones. ODM opportunity mostly in CDMA.<br />

Motorola The outsourcing ratio is already high for EMS and ODM<br />

Sony Ericsson Limited room for outsourcing growth. Flextronics, Arima Comm, and FIH are already the key EMS partners.<br />

Samsung Started outsourcing casing / keypad from FIH / BYD / Silitech. No immediate plans for assembly outsourcing.<br />

LG Only outsources selected low-end models to ODMs, limited EMS opportunity.<br />

ZTE/Huawei ZTE: Limited EMS opportunity due to in-house assembly capacity, but components are largely outsourced.<br />

Huawei: Both component and assembly are outsourced from three vendors—FIH, BYD, and Flextronics.<br />

Source: J.P. Morgan.<br />

Table 52: ODM partnerships<br />

Asia Pacific Equity Research<br />

20 April 2009<br />

Pure ODMs could find it difficult to sustain due to competition from EMS<br />

Pure ODM companies, such as Compal Communications and Arima<br />

Communications, are facing competition from FIH and BYD, which also provide<br />

ODM services. The weakness of Motorola and Sony Ericsson further accelerates the<br />

fall-out of these two companies.<br />

Vendor ODM partner Comments<br />

Nokia FIH, BYD Electronic FIH does CDMA ODM and BYD is starting to ramp up. Compal Comm may<br />

also get some CDMA orders.<br />

Motorola FIH, Compal Communications Compal Comm remains the key ODM. FIH (Chi-Mei Comm) also has good<br />

shares.<br />

Samsung No ODM in the near future<br />

LG Arima Comm Unlikely to add another ODM partner in the near future<br />

Sony Ericsson<br />

Source: J.P. Morgan.<br />

FlH, Arima Communication Could give more ODM orders to FIH<br />

Factors affecting the supply chain<br />

The dynamics at top handset makers tend to affect the Asian supply chain<br />

significantly. Most of the Taiwan supply chain is heavily exposed to Nokia,<br />

Motorola and Sony Ericsson. As a result, any handset vendor gaining market share<br />

could result in a “make-or-break” situation for the suppliers. Of late, huge currency<br />

swings have also affected the profitability of these companies, as most of their sales<br />

are foreign currency denominated.<br />

Taiwan supply chain: Mostly exposed to a struggling customer base<br />

The Taiwan handset supply chain is largely exposed to Nokia/Motorola/Sony<br />

Ericsson (Table 53), and has relatively little exposure to smartphone brands or the<br />

whitebox market. As the former group is under pressure and we expect the top five<br />

OEMs to show a revenue decline, the Taiwan supply chain may come under severe<br />

pressure.<br />

103

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