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Tech Hardware Supply Chain - Gazhoo

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Bhavin Shah<br />

(852) 2800-8538<br />

bhavin.a.shah@jpmorgan.com<br />

118<br />

Figure 66: Samsung’s F490<br />

(Haptic)<br />

Source: www. samsung.com.<br />

Asia Pacific Equity Research<br />

20 April 2009<br />

Imagis, a fabless IC design house in Korea, provides driver ICs for the VibeTonz<br />

system of SEC’s Haptic phone. Given the relatively low-entry barrier of driver IC<br />

coupled with high dependence on IMMR, we expect that benefits from the emerging<br />

Haptic trend to driver IC design companies could be limited.<br />

We also project Haptic-enhanced handsets to drive the demand for LRA (Linear<br />

Resonant Actuator), as LRA motors enable handsets to realize more dedicated<br />

movement of vibrations, compared to the ERM (Eccentric Rotating Mass) actuator<br />

type. We believe SEMCO is currently supplying LRAs for SEC’s Haptic phone.<br />

Jahwa Electronics (033240 KS, Not Rated) also claims that it is a potential<br />

beneficiary of the Haptic handset trends as it will likely provide LRA motors to<br />

SEC’s Haptic-enhanced handsets.<br />

SEC’s F490 (Haptic)<br />

SEC has come out with a new range of touchscreen phones which include the haptic<br />

feedback. The prominent ones are F480, F490 and Omnia. SECF490 has a 3.2-inch<br />

260,000 color touchscreen, 5MP camera and supports HSDPA. It has Haptic<br />

feedback, 16:9 wide screen, internet browsing.<br />

Acoustic components<br />

Acoustic components for the mobile handset can be categorized into built-in<br />

components and accessories. Built-in components include miniature receiver,<br />

microphone, polyphonic speaker and vibrator. Accessories refer to headset.<br />

Major handset acoustic component makers include Hosiden (Japan–receiver);<br />

Pioneer (Japan–speaker); Philips (Europe–speaker); AAC (China–<br />

receiver/speaker/microphone); Merry (Taiwan–headset); BSE (Korea–microphone);<br />

and Knowles (US–MEMS microphone).<br />

Acoustic components carry the critical task of receiving and producing sounds in<br />

mobile phones. Key trends for the technology development include:<br />

• Noise cancellation microphone: This has been adopted by Motorola in its<br />

ClearTalk technology, which uses 2 or 4 microphones to achieve the noisecancellation<br />

effect.<br />

• MEMS microphone: While more expensive, we believe MEMS microphone is<br />

more consistent and small in size.<br />

• Multi-functional device: Motorola first tried receiver/speaker/vibrator 3-in-1<br />

device in MOTOFONE in late 2006, and now Nokia is adopting this strategy to<br />

cut costs without sacrificing the acoustics performance.<br />

Camera module<br />

There are two key components within the phone camera module: (1) sensor; and<br />

(2) lens, which account for ~50% and ~20% module BOM cost, respectively.<br />

Packaging is another critical technology for making a good camera module.<br />

Sensors<br />

Due to cost concerns, most sensors used are complementary metal-oxide<br />

semiconductor (CMOS). CMOS sensor has come a long way from having low<br />

resolution a few years ago to now accommodating 8-10 mega-pixels in digital

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