High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
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_________________________________________________________________ APPENDIX E<br />
APPENDIX E. VERIFYING CHIPS MADE OUTSIDE THE<br />
UNITED STATES<br />
RANDY GOODALL, SEMATECH<br />
Q2 - Verifying Chips Made by<br />
Foreign Suppliers / Sites<br />
• Unlikely to be verifiable by non-destructive testing<br />
• Signal testing<br />
– Probably in the NP group <strong>of</strong> problems (“traveling salesman”)<br />
– Hueristics likely, but what is good enough in advanced 21 st<br />
century warfare?<br />
• Measurement testing<br />
– Acoustic and high -energy photon imaging, mechanical (mass,<br />
moments <strong>of</strong> inertia, …)<br />
– Must have the resolution <strong>of</strong> devices/layers (nano somethings)<br />
– Non-complex wave analysis is non -deterministic<br />
– Isomorphic to the intractable wafer (or reticle) inspection<br />
problem, but with HUGE signal-to -noise ratio due to intervening<br />
medium <strong>of</strong> package and/or upper layers<br />
• Unpackaged is only a little better proposition<br />
• What cost penalty is allowed?<br />
– Comparison to building/upgrading a small fab?<br />
SEMATECH Briefing to DSB - June 23, 2004 • Slide 23<br />
HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________<br />
93
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