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High Performance Microchip Supply - Under Secretary of Defense ...

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RECOMMENDATIONS ____________________________________________________________<br />

advanced technology degrees in U.S. universities must be<br />

encouraged to remain in this country to help move the technology<br />

base forward. Technology is portable in the minds <strong>of</strong> these students,<br />

and their departure is our loss and others’ gain.<br />

The Department <strong>of</strong> <strong>Defense</strong> needs to solicit the support and<br />

cooperation <strong>of</strong> other government organizations to maintain the<br />

supply <strong>of</strong> U.S.-built trusted semiconductors. The USTR must<br />

monitor foreign countries with regard to practices that distort trade<br />

and investment patterns and jeopardize U.S. intellectual property<br />

issues. The NSF must be funded to boost university research in<br />

nanoelectronics and beyond.<br />

The United States is still the leader in technology, and a sufficient<br />

supply <strong>of</strong> many trusted microelectronic components is available. The<br />

trends <strong>of</strong> the last few years, however, indicate that this will not<br />

continue in the near term unless direct action is taken in the<br />

immediate future.<br />

RECOMMENDATION 3 – UNDERSTAND THE TRUSTED<br />

MICROELECTRONICS NEED – ENUMERATION<br />

The DUSD(IP) is leading a DOD effort to collect component<br />

acquisition data from 23 DOD prime end item contractors. 38 In this<br />

effort, the under secretary has asked the firms to identify all ASICs<br />

included in their prime end items. Based upon preliminary and as<br />

yet incomplete feedback from this survey, DOD products entering or<br />

in production are not generally using the most advanced IC<br />

technology. Feature sizes (an indicator <strong>of</strong> process maturity) for<br />

custom ASICs in systems such as the F-22, V-22, C-17, C-130J, B-1,<br />

Apache, SH-60 and M-1 tank are generally no smaller than 0.9<br />

microns – a 1980s-era technology. While the incompleteness <strong>of</strong> those<br />

data must be underscored, the smallest feature size found in this<br />

survey to date was 0.2 microns (early 1990s). This finding is not<br />

unexpected; disparity in product development cycle-times means<br />

that, to assure trusted sources for its in-production and in-fleet<br />

38. Institute for <strong>Defense</strong> Analyses study <strong>of</strong> DOD Integrated Circuit Demand (in progress).<br />

62 _________________________________________________________ DSB TASK FORCE ON

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