High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
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_________________________________________________________________ APPENDIX H<br />
APPENDIX H. DFAR SUPPLEMENT<br />
DEFENSE FEDERAL ACQUISITION REGULATION SUPPLEMENT<br />
Proposed<br />
(xxx.yyy-zzzz) Restriction on Acquisition <strong>of</strong> Application<br />
Specific Integrated Circuits<br />
1. Definitions. As used in this clause—<br />
a. ‘Application Specific Integrated Circuit’ or ‘ASIC’<br />
means any custom microelectronics device (digital or<br />
mixed-mode digital/analog) that is fabricated at a<br />
semiconductor foundry, including fully custom<br />
integrated circuits and gate array class devices.<br />
b. ‘Trusted Foundry’ means a semiconductor<br />
manufacturing facility that has been certified by the<br />
DOD to provide secure semiconductor fabrication and<br />
data management, including the capability for<br />
fabricating classified ASIC designs.<br />
2. Except as provided in paragraph (c) <strong>of</strong> this clause, all<br />
Application Specific Integrated Circuits delivered under this<br />
contract, either as end items or components <strong>of</strong> end items, shall<br />
be wholly fabricated and manufactured at a Trusted Foundry<br />
in the United States.<br />
3. The restriction under paragraph (b) <strong>of</strong> this clause does not<br />
apply to—<br />
c. Commercial-<strong>of</strong>f-the-shelf microelectronic devices that<br />
are procured via standard part numbers and are not<br />
modified at the manufacturer for DOD use.<br />
d. Field Programmable Gate Array devices that are<br />
procured via standard part numbers and are later<br />
personalized at DOD laboratories or Contractor<br />
facilities.<br />
HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________<br />
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