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High Performance Microchip Supply - Under Secretary of Defense ...

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_________________________________________________________________ APPENDIX H<br />

APPENDIX H. DFAR SUPPLEMENT<br />

DEFENSE FEDERAL ACQUISITION REGULATION SUPPLEMENT<br />

Proposed<br />

(xxx.yyy-zzzz) Restriction on Acquisition <strong>of</strong> Application<br />

Specific Integrated Circuits<br />

1. Definitions. As used in this clause—<br />

a. ‘Application Specific Integrated Circuit’ or ‘ASIC’<br />

means any custom microelectronics device (digital or<br />

mixed-mode digital/analog) that is fabricated at a<br />

semiconductor foundry, including fully custom<br />

integrated circuits and gate array class devices.<br />

b. ‘Trusted Foundry’ means a semiconductor<br />

manufacturing facility that has been certified by the<br />

DOD to provide secure semiconductor fabrication and<br />

data management, including the capability for<br />

fabricating classified ASIC designs.<br />

2. Except as provided in paragraph (c) <strong>of</strong> this clause, all<br />

Application Specific Integrated Circuits delivered under this<br />

contract, either as end items or components <strong>of</strong> end items, shall<br />

be wholly fabricated and manufactured at a Trusted Foundry<br />

in the United States.<br />

3. The restriction under paragraph (b) <strong>of</strong> this clause does not<br />

apply to—<br />

c. Commercial-<strong>of</strong>f-the-shelf microelectronic devices that<br />

are procured via standard part numbers and are not<br />

modified at the manufacturer for DOD use.<br />

d. Field Programmable Gate Array devices that are<br />

procured via standard part numbers and are later<br />

personalized at DOD laboratories or Contractor<br />

facilities.<br />

HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________<br />

101

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