High Performance Microchip Supply - Under Secretary of Defense ...

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INTRODUCTION _______________________________________________________________ special-purpose integrated circuits in new systems. Instead, subsystems designers are looking for solutions that employ older chip technologies or have moved to field programmable gate arrays (FPGAs) at the sacrifice of circuit speed and increased power. A further complication lies in the fact that the Defense Department does not directly acquire components at the integrated circuit level. Individual circuits are most often specified by the designers of subsystems; even system primes have little knowledge of the sources of the components used in their system-level products. Any DOD acquisition plan to address IC trustworthiness and availability must focus on defense suppliers as much as DOD itself. 26 _________________________________________________________ DSB TASK FORCE ON
__________________________________________________________________ FINDINGS FINDINGS THE INDUSTRY SITUATION Semiconductor technology and manufacturing leadership is a national priority that must be maintained if the U.S. military is to continue to lead in the application of electronics to support the warfighter. An integral part of that leadership is the close coupling of manufacturing with the development of advanced technology and the design of leading-edge integrated circuits. This coupling can best be achieved if development and manufacturing are colocated. Doing so provides an advantage to integrated device manufacturers who are able to coordinate design and process development to be first to market with leading-edge products. The transfer of technology from the laboratory to manufacturing is facilitated. U.S. industry’s share of capital expenditures falling…. 50% 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 1997 1998 1999 2000 2001 2002 2003 2004 North America Japan Europe Korea Taiwan Rest of the World Source: VLSI Research Figure 3 HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________ 27
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Page 8 and 9: TABLE OF CONTENTS__________________
Page 10 and 11: EXECUTIVE SUMMARY _________________
Page 22 and 23: INTRODUCTION ______________________
Page 34 and 35: FINDINGS __________________________
Page 62 and 63: RECOMMENDATIONS ___________________
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RECOMMENDATIONS ___________________
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TERMS OF REFERENCE ________________
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TERMS OF REFERENCE ________________
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DEPUTY SECRETARY OF DEFENSE MEMO __
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FUTURE TECHNOLOGY DEVELOPMENT _____
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RANDY GOODALL SEMATECH ____________
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TRUSTED FOUNDRY PROGRAM ___________
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TRUSTED FOUNDRY PROGRAM ___________
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COMPARISON OF ASIC AND FPGA SYSTEM
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DFAR SUPPLEMENT ___________________
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MINORITY REPORT ___________________
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ACRONYMS __________________________
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