High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
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FINDINGS ___________________________________________________________________<br />
although some risk is inherent in legacy part<br />
redesigns.<br />
Additional study by both the DOD and its suppliers<br />
is needed to determine how best to assure supplies<br />
<strong>of</strong> obsolete parts needed for system repair and<br />
replacement.<br />
Although there have been concerns about isolated<br />
supply problems (e.g., radiation-hardened and<br />
obsolete parts supplies), the full integrated supply<br />
problem has emerged onto the acquisition agenda<br />
and is only now being fully identified. DOD lacks a<br />
stable long-term investment, technology, and<br />
acquisition strategy capable <strong>of</strong> meeting its and its<br />
suppliers microelectronic component supply needs.<br />
Attempts to deal with microelectronics supply<br />
issues have been limited to isolated efforts to date.<br />
DOD lacks a long-term plan for the preservation <strong>of</strong><br />
U.S. information superiority, which is a cornerstone<br />
<strong>of</strong> U.S. national security. The department must<br />
either develop such a plan or be prepared to<br />
surrender this advantage, i.e., identify the<br />
alternative means by which national security will be<br />
assured in a regime <strong>of</strong> information inferiority.<br />
This conclusion is a call for the U.S. government in general, and<br />
the DOD and its suppliers specifically, to establish a series <strong>of</strong><br />
activities to ensure that the United States maintains reliable access to<br />
the full spectrum <strong>of</strong> microelectronics components, from commodity<br />
and legacy, to state-<strong>of</strong>-the-art parts, and application-specific ICs<br />
special technologies. These activities must provide assurance that<br />
each component’s trustworthiness (confidentiality, integrity, and<br />
availability) is consistent with that component’s military application.<br />
Over time, semiconductor design and production will almost<br />
certainly become more, not less, globalized, making risk mitigation<br />
strategies that rely strictly on domestic design and production<br />
increasingly difficult, if not impossible, to implement. Commercial<br />
firms may be eager to contract design and production services, but<br />
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