High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
High Performance Microchip Supply - Under Secretary of Defense ...
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___________________________________________________________ RECOMMENDATIONS<br />
Include an investigation <strong>of</strong> whether field<br />
programmable gate arrays (FPGAs) and selected<br />
COTS components need trusted design or<br />
foundry process controls.<br />
− Developing microelectronics designs that can be<br />
easily tested and evaluated.<br />
3. Implement Acquisition Policy<br />
The task force recommends that DOD pursue and<br />
enlarge the trusted foundry program already<br />
underway within the department. The use <strong>of</strong><br />
trusted foundries to manufacture components for<br />
Department <strong>of</strong> <strong>Defense</strong> systems will require changes<br />
in procedures at several levels in the acquisition<br />
process. Specific recommendations are as follows:<br />
− The Systems Program Office (SPO), in<br />
consultation with the prime contractor, should<br />
formally assess the level <strong>of</strong> trust required in a<br />
specific system (and its component subsystems)<br />
and document it during the system design and<br />
development (SDD) phase, with special<br />
consideration given to the application <strong>of</strong> the<br />
system and the potential damage to system<br />
utility that could be imposed by a determined<br />
adversary. Based on this high-level evaluation,<br />
the prime contractor program manager for each<br />
system should be responsible for developing and<br />
implementing procedures to meet the desired<br />
level <strong>of</strong> system trust. These procedures should<br />
include a comprehensive threat assessment and<br />
implementation <strong>of</strong> effective countermeasures at<br />
each level <strong>of</strong> system hierarchy at the time <strong>of</strong><br />
development as well as manufacturing, fielding<br />
and life-cycle support. Regarding the flowdown<br />
<strong>of</strong> this requirement to subcontractors, the DSB<br />
recognizes that many electronic subsystem<br />
contracts are small (i.e., less than $5 million) and<br />
that the resources and knowledge base <strong>of</strong><br />
HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________<br />
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