High Performance Microchip Supply - Under Secretary of Defense ...

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MINORITY REPORT _____________________________________________________________ This page intentionally left blank. _________________________________________________________ DSB TASK FORCE ON 104
_________________________________________________________________ APPENDIX J APPENDIX J. ACRONYMS AFOSR Air Force Office of Scientific Research AGED Advisory Group on Electron Devices AMD Advanced Micro Devices Inc. ARO Army Research Office ASIC Application Specific Integrated Circuit BIOS Basic Input Output System CFIUS Committee on Foreign Investments in the United States CMOS Complimentary Metal Oxide Semiconductor COTs Commercial off the Shelf CPLD Complex Programmable Logic Devices CPU Central Processing Units DARPA Defense Advanced Research Projects Agency DCMA Defense Control Management Agency DDR&E Director of Defense Research and Engineering DEPSECDEF Deputy Secretary of Defense DOD Department of Defense DoE Department of Energy DoS Department of State DoT Department of Transportation DRAM Dynamic Random Access Memory DSB Defense Science Board DTIC Defense Technical Information Center DTICS Defense Trusted Integrated Circuits Strategy DTRA Defense Threat Reduction Agency DUSD Deputy Under Secretary of Defense DUSD(IP) Deputy Under Secretary of Defense for Industrial Policy EMP Electro Magnetic Pulse EU European Union FPGA Field Programmable Gate Array GBI Ground Based Interceptor GFE Government Furnished Equipment IBM International Business Machines Inc. IC Integrated Circuit HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________ 105
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Defense Science Board Task Force On
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TABLE OF CONTENTS__________________
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EXECUTIVE SUMMARY _________________
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RECOMMENDATIONS ___________________
Page 64 and 65: RECOMMENDATIONS ___________________
Page 88: TERMS OF REFERENCE ________________
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Page 94: DEPUTY SECRETARY OF DEFENSE MEMO __
Page 98 and 99: FUTURE TECHNOLOGY DEVELOPMENT _____
Page 104 and 105: RANDY GOODALL SEMATECH ____________
Page 106 and 107: TRUSTED FOUNDRY PROGRAM ___________
Page 108 and 109: TRUSTED FOUNDRY PROGRAM ___________
Page 110 and 111: COMPARISON OF ASIC AND FPGA SYSTEM
Page 112 and 113: DFAR SUPPLEMENT ___________________
Page 116 and 117: ACRONYMS __________________________
Page 118: ___________________________________
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