High Performance Microchip Supply - Under Secretary of Defense ...

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ACRONYMS __________________________________________________________________ IDA Institute for Defense Analyses IP Intellectual Property IPT Integrated Product Team ITAR International Traffic in Arms Regulations JTRS Joint Tactical Radio System KIET Korean Institute of Electronics Technology M1A1 Abrams Main Battle Tank MIT Massachusetts Institute of Technology MMST Microelectronics Manufacturing Science and Technology MPU MicroProcessor Unit NDIA National Defense Industries Association NIST National Institute of Standards and Technology NSA National Security Agency NSC National Security Council NSF National Science Foundation ODUSD (IP) Office of the Deputy Under Secretary of Defense for Industrial Policy ONR Office of Navel Research OSD Office of the Secretary of Defense PECVD Plasma Enhanced Chemical Vapor Deposition PLA Programmable Logic Array PLD Programmable Logic Device RDT&E Research Development, Test and Evaluation RHMATD Radiation Hardened Microelectronics Accelerated Technology Development RHOC Radiation Hardened Oversight Council RISC Reduced Instruction Set Computer S&T Science and Technology SAR Synthetic Aperture Radar SDD System Design and Development SIA Semiconductor Industry Association SME Semiconductor Manufacturing Equipment SOC System on Chip SPO System Program Office SRAM Static Random Access Memory TI Texas Instruments Corporation TSMC Taiwan Semiconductor Manufacturing Company _________________________________________________________ DSB TASK FORCE ON 106
_________________________________________________________________ APPENDIX J UCLA University of California Los Angeles UMC United Microelectronics Corporation USD(ATL) Undersecretary of Defense for Acquisition, Technology, and Logistics USTR United States Trade Representatives VAT Value Added Tax WTO World Trade Organization HIGH PERFORMANCE MICROCHIP SUPPLY ___________________________________________ 107
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Defense Science Board Task Force On
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TABLE OF CONTENTS__________________
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EXECUTIVE SUMMARY _________________
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INTRODUCTION ______________________
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FINDINGS __________________________
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FINDINGS __________________________
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FINDINGS __________________________
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FINDINGS __________________________
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FINDINGS __________________________
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RECOMMENDATIONS ___________________
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RECOMMENDATIONS ___________________
Page 66 and 67: RECOMMENDATIONS ___________________
Page 88: TERMS OF REFERENCE ________________
Page 92 and 93: TERMS OF REFERENCE ________________
Page 94: DEPUTY SECRETARY OF DEFENSE MEMO __
Page 98 and 99: FUTURE TECHNOLOGY DEVELOPMENT _____
Page 104 and 105: RANDY GOODALL SEMATECH ____________
Page 106 and 107: TRUSTED FOUNDRY PROGRAM ___________
Page 108 and 109: TRUSTED FOUNDRY PROGRAM ___________
Page 110 and 111: COMPARISON OF ASIC AND FPGA SYSTEM
Page 112 and 113: DFAR SUPPLEMENT ___________________
Page 114 and 115: MINORITY REPORT ___________________
Page 118: ___________________________________
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