Guide to STN Patent Databases – Basic Version - Paton - TU Ilmenau

Patent databases on STN International
ABEN
The invention relates to a chip module, particularly for optical and
stress-sensitive measurements, comprising at least the following: a premold
housing (1) consisting of a housing body (10) which is made of a plastic or
epoxy resin material and provided with a housing edge (16) and a housing
bottom (15), in addition to a lead frame (14) which is injected therein and
provided with several leads (5) which extend through the housing body (10)
and which are bent in such a way that they extend respectively inside (17)
the premold housing (1) in bond pads (20) and are laid bare on the lower side
(15a) of the bottom of the housing (15) in ball pads (6,7) which are embodied
...
ABFR
L'invention concerne un module de puce, servant notamment a des mesures
optiques et sensibles aux contraintes, presentant au moins: un boitier
premoule (1), qui comprend un corps (10) constitue d'une matiere plastique ou
d'une resine epoxy, comportant un bord (16) et un fond (15), ainsi qu'une
grille de connexion (14) injectee dans ce dernier, pourvue de plusieurs
connecteurs (5) qui s'etendent a travers le corps de boitier (10) et sont
coudes de facon a etre degages dans le compartiment interieur (17) du boitier
...
ABDE
Die Erfindung betrifft ein Chipmodul, insbesondere fuer optische und
stressempfindliche Messungen, das mindestens aufweist: ein Premoldgehaeuse
(1), das einen, aus einem Kunststoff- oder Epoxid- harz-Material gefertigten,
Gehaeusekoerper (10) mit einem Gehaeuserand (16) und einem Gehaeuseboden (15)
und einen in diesen eingespritzten Leadframe (14) mit mehreren Leads (5)
aufweist, die sich durch den Gehaeusekoerper (10) erstrecken und derartig
gebogen sind, dass sie jeweils im Innenraum (17) des Premoldgehaeuses (1) in
Bondpads (20) und auf der Unterseite (15a) des Gehaeusebodens (15) in
...
DETDEN
[0001] Chip module and procedure for its production
[0002] The invention concerns a chip module with a micromechanically
structured sensor element for optical or stress-sensitive measurements, which
is usable in particular in the automotive range, as well as a procedure for
its production.
[0003] Such chip modules can be in particular gas sensor modules with sensor
chips for the detection of CO2, which is used e.g. in CO2-betriebenen
KfZKlimaanlagen for detection by leakages.
...
CLMEN
1. Chip module, in particular for optical or stress-sensitive applications,
which exhibits at least: a Premoldgehaeuse (1), which exhibits a housing body
(10) with an edge of housing (16) and a housing bottom (15) and one,
gefertigen from a Kunststoffoder epoxy resin material, into the housing body
(10) injected Leadframe (14) with several Leads (5), which by the housing
body (10) extend and are so curved that they lie exposed in each case in the
interior (17) of the Premoldgehaeuses (1) in Bondpads (20) and on the lower
surface (15a) of the housing bottom (15) in ball Pads (6, 7), and at least
one chip (26, 28, 30a, b), in that Premoldgehaeuse (1) is fastened and
Kontaktpads (44) exhibits, which with the Bondpads (20) the Leads (5) over
itself is contacted by the interior (17) of the Premoldgehaeuses (1)
extending wire bonds (46).
2. Chip module according to requirement 1, by the fact characterized that the
Premoldgehaeuse (1) mount by a Surface technology - procedure can be mounted.
...
DETDDE
[0001] Chipmodul und Verfahren zu dessen Herstellung
[0002] Die Erfindung betrifft ein Chipmodul mit einem mikromechanisch
strukturierten Sensorelement fuer optische oder stressempfindliche Messungen,
das insbesondere im Automotive-Bereich verwendbar ist, sowie ein Verfahren zu
dessen Herstellung.
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