Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Pb Free Early Learn<strong>in</strong>g Summary<br />
Contact resistance similar or lower than that of eutectic<br />
BGA and 90/10 BGA and CCGA<br />
Ball deformation from burn-<strong>in</strong> sockets less than with<br />
eutectic BGA<br />
Less solder material transfer onto socket contact than<br />
with eutectic solder<br />
Early learn<strong>in</strong>g results <strong>in</strong>dicate no problems with us<strong>in</strong>g<br />
exist<strong>in</strong>g BGA <strong>in</strong>terconnect hardware <strong>in</strong> lead free<br />
module test and burn-<strong>in</strong><br />
<strong>Test</strong><strong>in</strong>g Lead Free Area Array Packages <strong>BiTS</strong> 2003<br />
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