Burn-in & Test Socket Workshop - BiTS Workshop

More documents

Recommendations

Info

Experimental Detail / Analysis Stage 4 Summary ‣ Contact Resistance (0.5 mm) ‣ Overall resistance much higher with spring contact (both Crown and V-groove) ‣ PdNi and Au very similar in all cases ‣ Overall resistance much less variable than other contact types ‣ Crown contact slightly more variable on NoPb samples Log Resistance (O) 100 10 1 0 Contact resistance - 0.5mm No Pb Pb 0 24 72 168 504 0 24 72 168 504 Au Crown - W/ Bias Au Crown Au V-groove - W/ Bias Au V-groove PdNi Crown- W/ Bias PdNi Crown The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 22
Experimental Detail / Analysis Stage 4 Summary ‣ Witness Marks ‣ Differences between Pb and No Pb were significant ‣ Multiple insertions had largest impact on total deformations 0.5mm Crown witness marks Surface Area 9.0% 8.0% 7.0% 6.0% 5.0% 4.0% 3.0% 2.0% 1.0% 0.0% Ball Indent - 0.5mm 0.5mm Crown 0.5mm V-groove No Pb Pb ‣ Witness marks across all balls of each sample device were very consistent ‣ Wide variation in witness marks between samples ‣ Ball Sticking 0.5mm Crown witness marks Force (grams) 70 60 50 40 30 20 10 Ball Sticking - 0.5mm Au-Crown Au-V-groove PdNi-Crown ‣ Crown contact with Pb worst sticking 0.5mm V Groove witness marks 0 No Pb Pb The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 23
Page 1 and 2:
Burn-in & Test Socket Workshop Marc
Page 3 and 4:
Burn-in & Test Socket Workshop Sess
Page 5 and 6:
Objectives • Determine impact of
Page 7 and 8:
Pb free - Background • Why Pb fre
Page 9 and 10:
Typical Test Setup • Pneumatic co
Page 11 and 12:
PBGA Test Socket Resistance at Cycl
Page 13 and 14:
CBGA Test Socket Resistance • Dai
Page 15 and 16:
CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18:
CCGA Contact Resistance Average Res
Page 19 and 20:
PBGA Contactor Resistance at Burnin
Page 21 and 22:
Ball Damage 1.00mm Pitch Contactor
Page 23 and 24:
PBGA Contactor Resistance at Burnin
Page 25 and 26:
PBGA Contactor Cleaning • Surface
Page 27 and 28:
Pb Free Early Learning Summary Con
Page 29 and 30:
Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58: Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60: Conclusion • Changes made to cont
Page 61 and 62: The Effects of No Lead Solder Balls
Page 63 and 64: What we asked… Experimental Objec
Page 65 and 66: Evaluation Criteria Overview of Exp
Page 67 and 68: Overview of Experiment Test Methods
Page 69 and 70: Stage 2 Objective Experimental Deta
Page 71 and 72: Experimental Detail / Analysis Stag
Page 81: Experimental Detail / Analysis Stag
Page 85 and 86: • General Observations Summary of
Page 87 and 88: Conclusions • Overall performance
show all

Burn-in & Test Socket Workshop - BiTS Workshop

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?