Burn-in & Test Socket Workshop - BiTS Workshop

More documents

Recommendations

Info

Test Process • Build several contactors of the same design populated with three different pins • Measure metallurgical content of lead plating • Our standard pin • Standard pin with a smoother micro surface • Standard pin with a surface profile that will provide a nominal point scrub on the device • Plot pin resistance measurements (Mean, Variance, Median, Mode, and Range) • Measure the Kelvin contact resistance of the pins and and its variance at six different temperatures: -40° C, -20°C, 0°C, controlled ambient (22°C), +80°C, +125°C when contacting - 100% Sn device lead plating - 10% Pb/90% Sn device lead plating
Metallurgical Plating Test • Test Method(s) Description: • Scanning electron microscopy (SEM) with a light element energy dispersive spectrometer (EDS) was used to provide the data for the plating composition of the two types of leads provided • Three leads in a set of fourteen, the third, seventh, and twelfth leads had three area analyses performed on each of the samples • Area analyses rather than spot analyses were performed due to the non-homogenous nature of the tin lead plating composition • The analyses were performed at an accelerating voltage of 20 kV, a working distance of 13.5 mm, and at a magnification of 600X
Page 1 and 2: Burn-in & Test Socket Workshop Marc
Page 3 and 4: Burn-in & Test Socket Workshop Sess
Page 5 and 6: Objectives • Determine impact of
Page 7 and 8: Pb free - Background • Why Pb fre
Page 9 and 10: Typical Test Setup • Pneumatic co
Page 11 and 12: PBGA Test Socket Resistance at Cycl
Page 13 and 14: CBGA Test Socket Resistance • Dai
Page 15 and 16: CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18: CCGA Contact Resistance Average Res
Page 19 and 20: PBGA Contactor Resistance at Burnin
Page 21 and 22: Ball Damage 1.00mm Pitch Contactor
Page 23 and 24: PBGA Contactor Resistance at Burnin
Page 25 and 26: PBGA Contactor Cleaning • Surface
Page 27 and 28: Pb Free Early Learning Summary Con
Page 29 and 30: Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35: Test Objective • Metallurgical Pl
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58: Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60: Conclusion • Changes made to cont
Page 61 and 62: The Effects of No Lead Solder Balls
Page 63 and 64: What we asked… Experimental Objec
Page 65 and 66: Evaluation Criteria Overview of Exp
Page 67 and 68: Overview of Experiment Test Methods
Page 69 and 70: Stage 2 Objective Experimental Deta
Page 71 and 72: Experimental Detail / Analysis Stag
Page 85 and 86: • General Observations Summary of
Page 87 and 88:
Conclusions • Overall performance
show all

Burn-in & Test Socket Workshop - BiTS Workshop

Create successful ePaper yourself

Delete template?

Save as template?