Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
You also want an ePaper? Increase the reach of your titles
YUMPU automatically turns print PDFs into web optimized ePapers that Google loves.
Evaluation Criteria<br />
Overview of Experiment<br />
‣ Contact Resistance / Device Monitor<strong>in</strong>g<br />
‣ Room temp tests, 2 and 20 ball cha<strong>in</strong>s (16 per socket)<br />
‣ Real time monitor<strong>in</strong>g dur<strong>in</strong>g bias burn-<strong>in</strong> (2 per socket)<br />
‣ Ball Stick<strong>in</strong>g<br />
‣ Instron force measurement of socket actuation<br />
‣ Ball Deformation<br />
‣ RVSI scann<strong>in</strong>g for diameter, coplanarity<br />
‣ Witness Marks<br />
‣ Visual <strong>in</strong>spection, impr<strong>in</strong>t measurement for various contacts<br />
‣ Ball Hardness<br />
‣ Hardness test<strong>in</strong>g of solder balls after experiment<br />
‣ Solder Transfer / Migration<br />
‣ Visual <strong>in</strong>spection, cross section<strong>in</strong>g and analysis of <strong>in</strong>terfaces<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 5