Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Stage 2 Objective<br />
Experimental Detail / Analysis<br />
‣Establish basel<strong>in</strong>es for test conditions<br />
‣Confirm experimental parameters<br />
‣ Current<br />
‣ Temperature<br />
‣ Measurement techniques<br />
Contact<br />
Resistance<br />
Ball Stick<br />
Contact<br />
Resistance<br />
Bias Bake<br />
100C 125C 150C<br />
Witness<br />
Marks<br />
Device<br />
Heat<strong>in</strong>g<br />
Solder Ball<br />
Contact<br />
Type<br />
Plat<strong>in</strong>g<br />
Type<br />
Temp<br />
°C<br />
Force<br />
Current<br />
Time<br />
(Hrs.)<br />
Pb<br />
Spoon (1.0mm)<br />
Au<br />
35<br />
100%<br />
0 mA<br />
0<br />
No Pb<br />
P<strong>in</strong>ch (0.8mm)<br />
PdNi<br />
100<br />
125%<br />
50 mA<br />
24<br />
Spr<strong>in</strong>g (0.5mm) Crown<br />
NiBn<br />
125<br />
72<br />
Spr<strong>in</strong>g (0.5mm) V-Groove<br />
150<br />
168<br />
504<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 9