Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
Burn-in & Test Socket Workshop - BiTS Workshop
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Experimental Detail / Analysis<br />
Stage 3 Summary (Cont.)<br />
‣ Ball Stick<strong>in</strong>g<br />
‣ Large variation <strong>in</strong> ball stick<strong>in</strong>g <strong>in</strong> all splits, but all appear to have<br />
<strong>in</strong>creased over time<br />
‣ No Pb appears to have higher stick<strong>in</strong>g<br />
‣ Samples exposed to high temperature clearly stuck more than<br />
controls<br />
‣ Au and PdNi contacts stuck more than NiBn<br />
‣ Ball stick<strong>in</strong>g residue visible on both biased and unbiased contacts<br />
Force (grams)<br />
300<br />
200<br />
100<br />
0<br />
Ball Stick<strong>in</strong>g - 1.0mm<br />
No Pb<br />
Pb<br />
Au NiBn PdNi Au NiBn PdNi<br />
Control<br />
504 Hr #1<br />
504 Hr #2<br />
504 Hr #3<br />
504 Hr #4<br />
24 Hr<br />
72 Hr<br />
168 Hr<br />
Solder Ball / Plat<strong>in</strong>g<br />
The Effects of No Lead Solder Balls on <strong>Burn</strong>-<strong>in</strong> <strong>Socket</strong> Design Decisions Page 16
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