Burn-in & Test Socket Workshop - BiTS Workshop

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COPYRIGHT NOTICE • The papers in this publication comprise the proceedings of the 2003 BiTS Workshop. They reflect the authors’ opinions and are reproduced as presented , without change. Their inclusion in this publication does not constitute an endorsement by the BiTS Workshop, the sponsors, or the Institute of Electrical and Electronic Engineers, Inc. · There is NO copyright protection claimed by this publication. However, each presentation is the work of the authors and their respective companies: as such, proper acknowledgement should be made to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author/s or their companies.
Burn-in & Test Socket Workshop Session 6 Tuesday 3/04/03 4:00PM Technical Program Socketing Lead Free Packages “Lead Free Area Array Module Test And Burnin” Ethan Gallagher – IBM Microelectronics Zenon Podpora – IBM Microelectronics “Lead Free Contacting” Bert Brost – Johnstech International Corporation “The Effects Of No Lead Solder Balls On Burn-in Socket Design Decisions” Mike Noel – Motorola Semiconductor Products Don VanOverloop – Motorola Semiconductor Products Daniel Wilcox – Motorola Semiconductor Products K.Y. Yap – Motorola Semiconductor Products Tom Lyzinski – Wells-CTI Keith Callahan – Wells-CTI
Page 1: Burn-in & Test Socket Workshop Marc
Page 5 and 6: Objectives • Determine impact of
Page 7 and 8: Pb free - Background • Why Pb fre
Page 9 and 10: Typical Test Setup • Pneumatic co
Page 11 and 12: PBGA Test Socket Resistance at Cycl
Page 13 and 14: CBGA Test Socket Resistance • Dai
Page 15 and 16: CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18: CCGA Contact Resistance Average Res
Page 19 and 20: PBGA Contactor Resistance at Burnin
Page 21 and 22: Ball Damage 1.00mm Pitch Contactor
Page 23 and 24: PBGA Contactor Resistance at Burnin
Page 25 and 26: PBGA Contactor Cleaning • Surface
Page 27 and 28: Pb Free Early Learning Summary Con
Page 29 and 30: Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54:
Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56:
90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58:
Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60:
Conclusion • Changes made to cont
Page 61 and 62:
The Effects of No Lead Solder Balls
Page 63 and 64:
What we asked… Experimental Objec
Page 65 and 66:
Evaluation Criteria Overview of Exp
Page 67 and 68:
Overview of Experiment Test Methods
Page 69 and 70:
Stage 2 Objective Experimental Deta
Page 71 and 72:
Experimental Detail / Analysis Stag
Page 73 and 74:
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Page 79 and 80:
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Page 83 and 84:
Page 85 and 86:
• General Observations Summary of
Page 87 and 88:
Conclusions • Overall performance
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Burn-in & Test Socket Workshop - BiTS Workshop

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