Burn-in & Test Socket Workshop - BiTS Workshop

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Agenda • Brief history on lead free packaging • Test – Plastic BGA contact resistance – Ceramic BGA & CGA contact resistance and ball damage • Burnin – Plastic BGA contact resistance and ball damage • Summary of the early learning evaluations Testing Lead Free Area Array Packages BiTS 2003 3
Pb free – Background • Why Pb free microelectronics packages? – Environmental concerns with Pb disposition – consumer electronics – Drivers • Legislative - RoHS - Restriction of Hazardous Substances – Implementation July 2006 – Server exemption till Jan 2010 – Somewhat ambiguous – many items undefined • Customer/Market – most urgent ?? Testing Lead Free Area Array Packages BiTS 2003 4
Page 1 and 2: Burn-in & Test Socket Workshop Marc
Page 3 and 4: Burn-in & Test Socket Workshop Sess
Page 5: Objectives • Determine impact of
Page 9 and 10: Typical Test Setup • Pneumatic co
Page 11 and 12: PBGA Test Socket Resistance at Cycl
Page 13 and 14: CBGA Test Socket Resistance • Dai
Page 15 and 16: CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18: CCGA Contact Resistance Average Res
Page 19 and 20: PBGA Contactor Resistance at Burnin
Page 21 and 22: Ball Damage 1.00mm Pitch Contactor
Page 23 and 24: PBGA Contactor Resistance at Burnin
Page 25 and 26: PBGA Contactor Cleaning • Surface
Page 27 and 28: Pb Free Early Learning Summary Con
Page 29 and 30: Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58:
Resistance in Ohmsa 0.03 0.025 0.02
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Conclusion • Changes made to cont
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The Effects of No Lead Solder Balls
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What we asked… Experimental Objec
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Evaluation Criteria Overview of Exp
Page 67 and 68:
Overview of Experiment Test Methods
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Stage 2 Objective Experimental Deta
Page 71 and 72:
Experimental Detail / Analysis Stag
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• General Observations Summary of
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Conclusions • Overall performance
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Burn-in & Test Socket Workshop - BiTS Workshop

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