Burn-in & Test Socket Workshop - BiTS Workshop

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Experimental Detail / Analysis Stage 3 Summary (cont.) ‣ Witness Marks ‣ Witness marks much more evident on Pb than on No Pb (nearly 50% larger) ‣ In general, witness marks covered very small percentage of surface area ‣ Devices exposed to temperature had much larger witness marks for both Pb and No Pb samples, increased over time ‣ Controls showed very little witness marks, similar in size between Pb and NoPb Surface Area Surface Area 9.0% 8.0% 7.0% 6.0% 5.0% 4.0% 3.0% 2.0% 1.0% 0.0% 9.0% 8.0% 7.0% 6.0% 5.0% 4.0% 3.0% 2.0% 1.0% 0.0% Ball Indent - 0.8mm NoPb Pb T0 T72 T504 T0 T72 T504 Time Ball Indent – 1.0mm NoPb Pb T0 T72 T504 T0 T72 T504 Time Range Average Range Average The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 18
Experimental Detail / Analysis Stage 3 Summary (cont.) ‣ Ball Hardness (Room Temp) ‣ No significant difference due to: ‣ Ball diameter (1.0mm and 0.8mm pitch) ‣ Pb and No Pb samples ‣ Solder Transfer / Migration ‣ Solder transfer observed on several samples. ‣ Minimal initial evidence of migration in Au or PdNi contacts at T504 (Continuing analysis of migration at this time). Force (grams) 35.00 30.00 25.00 20.00 15.00 10.00 5.00 0.00 NoPb 0.8mm Ball Hardness Pb 1.0mm 0.8mm Pitch 1.0mm Examples of Solder transfer to spoon contact Range Average The Effects of No Lead Solder Balls on Burn-in Socket Design Decisions Page 19
Page 1 and 2:
Burn-in & Test Socket Workshop Marc
Page 3 and 4:
Burn-in & Test Socket Workshop Sess
Page 5 and 6:
Objectives • Determine impact of
Page 7 and 8:
Pb free - Background • Why Pb fre
Page 9 and 10:
Typical Test Setup • Pneumatic co
Page 11 and 12:
PBGA Test Socket Resistance at Cycl
Page 13 and 14:
CBGA Test Socket Resistance • Dai
Page 15 and 16:
CBGA Test Damage 90/10 Leadfree Wit
Page 17 and 18:
CCGA Contact Resistance Average Res
Page 19 and 20:
PBGA Contactor Resistance at Burnin
Page 21 and 22:
Ball Damage 1.00mm Pitch Contactor
Page 23 and 24:
PBGA Contactor Resistance at Burnin
Page 25 and 26:
PBGA Contactor Cleaning • Surface
Page 27 and 28: Pb Free Early Learning Summary Con
Page 29 and 30: Up Front Concerns with Lead-Free So
Page 31 and 32: Lead-free Alloy Wish List (Short Li
Page 33 and 34: Undesirable Effects of Other Elemen
Page 35 and 36: Test Objective • Metallurgical Pl
Page 37 and 38: Metallurgical Plating Test • Test
Page 39 and 40: 100 % SN Plated Lead SEM micrograph
Page 41 and 42: Internal Device Resistance Baseline
Page 43 and 44: 90% Sn 10%Pb Tested at Plus 125º C
Page 45 and 46: Resistance in Ohms 0.02 0.018 0.016
Page 47 and 48: 100% Sn Lead Plating Tested at Plus
Page 49 and 50: Resistance in Ohms 0.05 0.045 0.04
Page 51 and 52: 90% Sn 10% Pb Lead Plating Tested a
Page 53 and 54: Resistenance in Ohms 0.035 0.03 0.0
Page 55 and 56: 90% Sn 10%Pb Tested at Plus 125º C
Page 57 and 58: Resistance in Ohmsa 0.03 0.025 0.02
Page 59 and 60: Conclusion • Changes made to cont
Page 61 and 62: The Effects of No Lead Solder Balls
Page 63 and 64: What we asked… Experimental Objec
Page 65 and 66: Evaluation Criteria Overview of Exp
Page 67 and 68: Overview of Experiment Test Methods
Page 69 and 70: Stage 2 Objective Experimental Deta
Page 71 and 72: Experimental Detail / Analysis Stag
Page 77: Experimental Detail / Analysis Stag
Page 85 and 86: • General Observations Summary of
Page 87 and 88: Conclusions • Overall performance
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Burn-in & Test Socket Workshop - BiTS Workshop

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